11.2 Upgrading the E-MADI64 boot code ............................................... 149
11.3 Upgrading the E-MADI64 application, DSP and FPGA code using EHX . 152
11.4 Upgrading the E-MADI64 FPGA using the Xilinx tool set .................... 155
12 Upgrading E-DANTE64-HX cards ..................................... 158
13 Upgrading CellCom®/FreeSpeak® wireless systems ...... 161
14 Upgrading panels ........................................................... 162
14.1 Upgrading panels using EHX ......................................................... 162
14.2 Upgrading panel application code manually .................................... 165
14.3 Manually upgrading V-Series panels .............................................. 177
15 Upgrading the TEL-14 module ........................................ 184
15.1 Upgrading the TEL-14 hardware .................................................... 184
15.2 Upgrading the TEL-14 firmware ..................................................... 186
16 Upgrading the AES-6 module .......................................... 189
16.1 Upgrading AES-6 FPGA ................................................................ 190
17 Upgrading FreeSpeak II™ wireless systems ................... 196
17.1 Upgrading FreeSpeak II Beltpacks and Antennas centrally using EHX . 196
17.2 Upgrading FreeSpeak II Beltpacks and Antennas via USB ................. 198
Appendix A: CPU card layout .............................................. 201
Appendix B: CPU card DIP switches ................................... 202
Appendix C: PiCo card layout ............................................. 204
Appendix D: Eclipse HX-PiCo CPU DIP switches ................. 205
Appendix E: Hitachi Renesas Flash Development Tool ....... 207
Appendix F: TFTPUtil .......................................................... 213
Appendix G: Tera Term ...................................................... 216
Appendix H: Flash Magic .................................................... 218
Appendix I: i-Station converter cable wiring and rear panel
layouts 222
Appendix J: Xilinx tools ...................................................... 224
Appendix K: Clear-Com
®
End User Software License ........... 225
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