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General| Series | 90-30 |
|---|---|
| Type | Programmable Logic Controller (PLC) |
| Relative Humidity | 5% to 95% non-condensing |
| Manufacturer | GE Fanuc (now part of Emerson) |
| Memory | Varies by CPU model |
| Power Supply | Various options (e.g., 120/240V AC, 24V DC) |
| I/O Modules | Digital, Analog, Specialty modules |
| I/O Capacity | Up to 512 I/O points |
| Communication Ports | RS-232, RS-485, Ethernet |
| Programming Software | Proficy Machine Edition |
| Programming Languages | Ladder Logic, Instruction List |
| Operating Temperature | 0°C to 60°C (32°F to 140°F) |
| Certifications | UL, CE |
Introduces the fundamental categories of PLC components: Baseplates, Power Supplies, CPUs, I/O Modules, Option Modules, and Cables.
Outlines the components needed to assemble a basic PLC system: baseplate, power supply, CPU, and I/O modules.
Explains the use of a 10-slot baseplate for systems requiring more than five modules.
Details adding Expansion or Remote racks using I/O Bus Expansion Cables.
Differentiates Expansion and Remote baseplates based on distance and communication speed.
Provides guidance on inspecting shipping containers for damage upon delivery.
Details steps for checking received components and recording serial numbers.
Instructions for mounting baseplates to panels and 19-inch racks.
Covers system grounding, ground conductors, and baseplate safety grounding.
Explains shield grounding for various CPU modules and other modules.
Provides color coding and wire routing recommendations to reduce noise.
Steps for installing TBQC assemblies for 16-point discrete I/O modules.
Details on connecting AC power to power supplies, including wiring.
Specific installation guidelines for systems with floating neutral (IT) configurations.
Describes the three basic types of baseplates: CPU, Expansion, and Remote.
Illustrates and describes common features found on all Series 90-30 baseplates.
Defines key terms related to baseplates like Backplane, Rack, Slot Number, and Module Location.
Details the two types of CPU baseplates: embedded and modular.
Describes features, limitations, and types of Expansion Baseplates.
Details features, limitations, and types of Remote Baseplates.
Lists available prewired I/O Bus Expansion cables and custom cable options.
Explains how to set the Rack Number using DIP switches for system identification.
Provides an example diagram for connecting Expansion baseplates.
Presents dimensions and spacing requirements for various baseplate types.
Categorizes power supplies into AC/DC Input and DC Input-Only types.
Details specifications and capacities for the standard AC/DC input power supply.
Provides specifications and capacities for the high capacity AC/DC input power supply.
Details specifications and capacities for the standard DC input power supply.
Provides specifications and capacities for the 48 VDC input power supply.
Details specifications and capacities for the high capacity 24 VDC input power supply.
Describes how to connect AC/DC power sources to the power supplies.
Explains the internal overvoltage protection devices and jumper strap.
Details the connections for the isolated +24 VDC output.
Describes status indicator lights, overvoltage protection, and output connections.
Illustrates the timing relationship of DC input, outputs, and PSOK signal.
Shows the location and function of the serial port connector on the power supply.
Overviews the two basic types of CPUs: Embedded and Modular.
Describes features of embedded CPU baseplates (Models 311, 313, 323).
Details features of modular CPU modules (Model CPU331 and higher).
Covers microprocessor types, CPU serial port, and memory volatility.
Explains the serial port connector on the power supply for CPU communication.
Defines volatile and non-volatile memory types (RAM vs. PROM).
Describes the RAM memory used for working memory in Series 90-30 CPUs.
Directs users to Chapter 6 for detailed backup battery information.
Explains EPROM, EEPROM, and Flash Memory types used in 90-30 CPUs.
Details the two primary uses of PROM devices: CPU firmware and user data storage.
Explains how to upgrade CPU firmware for new features or improvements.
Procedure for updating operating system firmware using a PC and software.
Methods for determining CPU revision levels (hardware and firmware).
Describes User PROM option for storing application programs and configuration data.
Compares EEPROM and EPROM features, practicality, and cost.
Details hardware features of CPU350 and CPU360 modules, identical except for labeling.
Describes similarities and differences in features and functionality for CPU351, 352, and 363.
Explains the three serial ports available on CPUs 351, 352, and 363.
Lists the protocols supported by Serial Ports on these modules.
Details hardware features of CPU364, including LEDs, Ethernet Restart, keyswitch, and ports.
Describes hardware features of CPU374, including LEDs, Ethernet Restart, and ports.
Explains the Lithium battery used for CMOS RAM memory and its location.
Provides step-by-step instructions for safely replacing the PLC battery.
Factors to consider for planning battery replacement and memory protection strategies.
Emphasizes the need for up-to-date backup copies of application programs.
Lists factors influencing battery life, such as usage, temperature, and CPU type.
Describes the three methods the PLC uses to warn of a low battery condition.
Discusses the advantages and disadvantages of using a battery-less scheme.
Explains the connection path for RAM memory backup between battery and memory circuits.
Describes the role of the super capacitor in maintaining memory during brief power outages.
Provides procedures for maintaining RAM memory during storage or shipment.
Details the Battery Accessory Kit for maintaining RAM memory without a power supply.
Describes the external module for long-term battery backup for modular CPUs.
Covers Discrete Input, Discrete Output, Discrete Input/Output, Analog Input, and Analog Output modules.
Details discrete I/O modules, including point density categories.
Describes features of standard density modules, including terminal boards and hinged covers.
Explains wiring choices for modules with 50-pin or dual 24-pin connectors.
Wiring options for modules featuring a single 50-pin connector.
Wiring options for modules featuring dual 24-pin connectors.
Describes basic features of analog modules: terminal board, cover, lens cap.
Provides wiring methods for analog modules, emphasizing shielded cable use.
Methods for connecting analog input modules, focusing on shield grounding.
Wiring guidelines for analog output modules, emphasizing shield grounding.
Information on current draw found in Chapter 12 and I/O Module Specifications Manual.
Information on third-party modules and the GE Fanuc Accompany Program.
Lists the option modules covered in this chapter.
Provides global communications on a Genius Bus for Series 90-30 PLCs.
Intelligent module for automatic global data communications on Genius Bus.
Provides interface between PLC and Genius I/O serial bus.
Interconnects Series 90-30 PLC to a FIP I/O serial bus.
Interfaces Series 90-30 I/O modules to a FIP bus.
Programmable one-axis or two-axis motion control module for Series 90-30 PLC.
High-performance, two-axis motion control module for digital servos.
High-performance motion control module for digital and analog servos.
Single-slot module for applications with high pulse input rates.
Provides interface between Series 90-30 PLC and Fanuc I/O LINK.
Allows Series 90-30 PLC to act as master on proprietary Fanuc I/O LINK.
Provides direct processing of rapid pulse signals for industrial control.
Attaches Series 90-30 PLC to Ethernet LAN via external transceiver.
High performance coprocessor for Series 90-30 Modular CPUs.
Provides temperature control for up to eight channels.
Measures electrical power consumption or monitors voltages.
Explains State Logic, which uses Natural Language programming, not ladder logic.
Lists primary State Logic hardware and software items for system completion.
Describes the five available State Logic CPU models.
Details the three embedded CPU baseplate models.
Describes the modular CPU models CSE331 and CSE340.
Explains the serial port connector on the power supply for State Logic CPUs.
Provides a cross-reference of catalog numbers to cable descriptions and applications.
Details the RS-232 cable for connecting PCM, ADC, CMM to Workmaster/PC-XT.
Details the RS-232 cable for connecting PCM, ADC, CMM to PC-AT.
Details the RS-232 cable for connecting PCM, ADC, CMM to Workmaster II/PS/2.
Describes the multidrop cable for interconnecting PLCs and APM modules.
Details I/O bus expansion cables, including custom length options.
Provides instructions for connecting I/O Bus Expansion cables.
Key information regarding maximum cable counts and lengths for expansion systems.
Explains shield treatment for cables to achieve best noise immunity.
Important alert for users of specific early remote baseplate versions.
Step-by-step instructions for building a 100% shielded cable.
Provides wiring configurations for I/O expansion system cables.
Shows example cable connections for expansion and remote baseplates.
Details I/O interface cables with right angle connectors, replacing obsolete models.
Instructions and catalog numbers for building custom 24-pin connector cables.
Describes various applications for factory-built or custom cables.
Lists programmer hardware products including WSI boards, converters, and HHPs.
Describes WSI boards providing RS-485 serial interface for PLC communication.
Provides information on the obsolete RS-232/RS-485 to RS-232 converter.
Details the Miniconverter Kit for RS-422 (SNP) to RS-232 conversion.
Describes the HHP for developing, debugging, and monitoring PLC programs.
Details the HHP keypad, display, memory card, and modes of operation.
Discusses basic considerations for planning a PLC system design.
Guides on determining the number and type of I/O points needed for the system.
Factors influencing I/O module selection like voltage, isolation, and response time.
Criteria for selecting option modules based on application requirements.
Factors for selecting a CPU, including performance, features, and memory.
Discusses limitations on the number of modules and baseplates based on CPU type.
Highlights restrictions on the maximum number of certain module types per system.
Notes restrictions on option module placement, requiring a CPU baseplate.
Compares CPU performance based on microprocessor and features like Ethernet.
Considers cost-effectiveness when choosing CPUs with extended features.
Discusses using modules with dual functions to conserve rack slots.
Guidance on selecting baseplates based on previous system requirements.
Describes the three choices for embedded CPU baseplates: 5-slot and 10-slot.
Explains the necessity of a modular CPU baseplate for modular CPUs.
Factors affecting power supply selection, including capacity and input voltage.
Details the three outputs (+5VDC, +24VDC Relay, +24VDC Isolated) of power supplies.
Suggests using Genius Blocks, Field Control, or VersaMax to reduce module count.
Basic safety guidelines to protect personnel and equipment from harm.
Guidelines to prevent accidental contact with hazardous voltages.
Measures to protect personnel from physical hazards like moving mechanisms.
Design considerations for fail-safe operation during electrical failures.
Importance of thorough documentation for safety circuits and features.
Methods like keylock switches and passwords for preventing unauthorized access.
Guidelines for labeling operator devices, guarding, and ensuring adequate lighting.
Ensuring safe access for operators and maintenance personnel.
Details indicator lights (LEDs) and terminal boards for hardware troubleshooting.
Explains the function of LEDs on Input, Output, Power Supply, CPU, and Option modules.
Information on using ladder screens, configuration screens, and fault tables.
Describes how contacts and coils are displayed and traced on ladder screens.
Using configuration screens to determine software/hardware matches and memory addresses.
Describes PLC Fault Table and I/O Fault Table for identifying system faults.
Using discrete references (%S) to determine status of conditions and faults.
Explains standard and mixed reference tables for displaying memory addresses and status.
Details the override feature for checking output circuits, emphasizing safety precautions.
Describes SER instruction for capturing discrete address status upon trigger signal.
Guidance on replacing modules, ensuring correct type and reloading application programs.
Information on product repairability and warranty service.
Provides a list of fuses for Series 90-30 modules, including part numbers.
Describes spare parts kits for modules and power supplies.
Provides a table of suggested preventive maintenance tasks for Series 90-30 PLCs.
Information on accessing GE Fanuc Web site, Fax Link system, and telephone numbers.
Describes the serial port and converters for Series 90 PLC communication.
Details cable assemblies, connectors, and computer grade wire specifications.
Shows serial port orientation and connector layout for Series 90 PLCs.
Information on the obsolete IC690ACC900 converter and its replacement.
Illustrates Point-to-Point and Multidrop serial port connections for Series 90 PLCs.
Illustrates typical RS-232 point-to-point connections to Series 90 PLCs.
Describes multidrop configurations for connecting multiple PLCs or devices.
Lists features of the converter, including interface, power, and cable connections.
Explains the converter's function in providing RS-232 serial interface.
Describes the converter's location and cable length limitations.
Provides instructions for installing the RS-422/RS-485 to RS-232 Converter.
Details pin assignments and signal definitions for the RS-232 interface.
Details pin assignments and signal definitions for the RS-422/RS-485 interface.
Shows the logic diagram for the RS-422/RS-485 to RS-232 Converter.
Explains jumper locations for user options on the converter board.
Provides examples of cable configurations for using the converter.
Describes the unit's features and purposes, such as ground isolation and signal conversion.
Details pin assignments and signal definitions for the RS-485 and RS-232 ports.
Illustrates various ways to connect the Isolated Repeater/Converter.
Provides rules for using repeater/converters in complex multidrop networks.
Shows cable diagrams referred to in system configurations for constructing cables.
Details the components of the Miniconverter Kit.
Shows pinouts for the RS-232 and RS-422 ports of the Miniconverter.
Describes point-to-point and multidrop configurations using the Miniconverter.
Illustrates cable connections for point-to-point configurations.
Lists features of the Port Isolator, such as opto-isolated channels and hot insertion.
Describes the two connectors (15-pin male and 15-pin female D-type) on the Isolator.
Provides the logic diagram for the RS-422/RS-485 to RS-232 Converter.
Instructions for installing the Isolator, including screw torque values.
Describes calculating heat dissipation for PLC components within an enclosure.
Outlines the steps for calculating module dissipation, power supply, and output/input circuits.
Explains how to calculate power dissipation for individual modules using voltage and current.
Method to calculate power supply dissipation based on module requirements.
Calculates power dissipation for discrete output module circuits.
Calculates power dissipation for discrete input module circuits.
Summarizes the final calculation steps for total rack heat dissipation.
References other chapters for rack dimensions and cable clearance requirements.
Information on ordering documentation separately and how products are categorized.
Lists publications for 90-30 PLC System, Installation, and Configuration Options.
Lists publications for Analog Input, Output, and Combination Modules.
Lists publications for all Series 90-30 Baseplates and configuration options.
Lists publications for I/O Link, FIP, Genius, Ethernet, and Comm. Coprocessor Modules.
Lists publications for Series 90-30 CPUs (IC693CPU311 - IC693CPU341).
Lists publications for Series 90-30 CPUs (IC693CPU350 - CPU374).
Lists installation and configuration publications for the Digital Valve Driver Module.
Lists installation and configuration publications for Discrete I/O Modules.
Lists publications for Genius Bus Controller, Genius Comm. Module, and Enhanced Genius Comm. Module.
Lists publications for High Speed Counter and Axis Positioning Modules.
Lists publications for Alphanumeric Coprocessor, Temp. Control, and I/O Processor Modules.
Provides a comprehensive list of all publications cited within the appendix.
Describes the TBQC system, its advantages, and how it connects modules to terminal blocks.
Details terminal blocks and cable selection for 16-point I/O modules.
Lists available cables and cross-references them to obsolete cable numbers.
Describes the I/O Face Plate that provides the connection to the terminal block.
Step-by-step instructions for installing the I/O Face Plate assembly.
Provides data sheets for terminal blocks, including common row terminals.
Details the IC693ACC329 TBQC terminal block and its mounting.
Details the IC693ACC330 TBQC terminal block and its mounting.
Details the IC693ACC331 TBQC terminal block and its mounting.
Details the IC693ACC332 TBQC terminal block and its mounting.
Details the IC693ACC333 TBQC terminal block and its mounting.
Describes TBQC components for 32-point modules with dual 24-pin connectors.
Details terminal blocks and their compatibility with 32-point I/O modules.
Explains SNP Multidrop system allowing programmer to connect to multiple PLCs.
Identifies sources for multidrop cables: GE Fanuc and custom built.
States limitations on cable length and number of slave devices in multidrop systems.
Details cable assemblies and recommended connector parts and specifications.
Provides examples of connecting CPUs and APMs to programmers in multidrop systems.
Basic steps for configuring programmer and assigning SNP IDs in a multidrop system.
Troubleshooting common issues like cable problems, incorrect SNP IDs, or communication mismatches.
Details specifications for the 10BASE-T transceiver.
Specifies the power requirement for the Ethernet transceiver.
Describes the LED indicators for Link Integrity and Power on the transceiver.
Provides specifications for the 10BASE2 transceiver.
Table of standard ASCII codes with decimal and hexadecimal values.
Provides approximate metric values for American Wire Gauge sizes.
Includes formulas and a table for Celsius to Fahrenheit temperature conversion.
Table of general conversion factors for various units of measurement.
Provides tables for length, area, and volume equivalents.
Information on the optional EMI line filter for early Series 90-30 PLCs.
Provides mounting dimensions for the EMI line filter.
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