Thermal/Mechanical Specifications and Design Guide 11
Introduction
1 Introduction
This document provides guidelines for the design of thermal and mechanical solutions
for 1-socket High End Desktop (HEDT) processor platforms. The processors covered are
listed in the Intel
®
Core™ i7 Processor Family for the LGA-2011 Socket Datasheet,
Volume 1 (see Tab l e 1- 1 ) and include the following:
• 2nd Generation Intel
®
Core
™
i7 Processor Family
—Intel
®
Core™ i7-3970X processor Extreme Edition
—Intel
®
Core™ i7-3960X processor Extreme Edition
—Intel
®
Core™ i7-3930K processor
—Intel
®
Core™ i7-3820 processor
The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA2011-0 socket, the Independent Loading Mechanism (ILM) and back plate.
The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
Figure 1-1. Platform LGA2011-0 Socket Stack with Tall-Heat Pipe Heatsink
To Next Page
Loading...
Need help?
General
