Thermal Solutions
100 Thermal/Mechanical Specifications and Design Guide
8.4 Structural Considerations
Mass of the Tall Heat Pipe Heat Sink and the Radial Fin Copper core Heat Sink does not
exceed 600 gm. The mass of the thermal solution includes all of the components,
including the clip, springs and fasteners.
From Ta b l e 5 - 3 , the Dynamic Compressive Load of 132 lbf max allows for designs that
exceed 600 gm as long as the mathematical product does not exceed 132 lbf. The Total
Static Compressive Load (Tab le 5 - 3 ) should also be considered in dynamic
assessments.
8.5 Attachment to the ILM
Refer to Figure 4-15 for the critical to function dimensions to attach a heatsink to the
LGA2011 socket ILM.
8.6 Thermal Interface Material
A thermal interface material (TIM) provides conductivity between the IHS and heat
sink.
Table 8-3. Intel
®
Reference Thermal Solution TIM
Thermal Solution TIM
T-HPHS
Tower (Cu/Al and Heatpipe)
SHIN-ETSU G751 (reference)
DOW TC-1996 (collaboration)
DRA-A
Cu Core Al Fins Al Radial Fin
DOW TC-1996
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