Thermal/Mechanical Specifications and Design Guide 15
Package Mechanical Specifications
2 Package Mechanical
Specifications
2.1 Package Mechanical Specifications
The Intel
®
Core™ i7-3960X, i7-3970X processor Extreme Edition, Intel
®
Core™ i7-
3930K processor, and Intel
®
Core™ i7-3820 processor are packaged in a 2011-land
Flip-Chip Land Grid Array package that interfaces with the baseboard using the
LGA2011-0 socket. The package consists of a processor mounted on a substrate land-
carrier. An integrated heat spreader (IHS) is attached to the package substrate and
core and serves as the mating surface for processor component thermal solutions, such
as a heatsink. Figure 2-1 shows a sketch of the processor package components and
how they are assembled together. Refer to Chapter 3, 4 and 5 for complete details on
the LGA2011-0 socket and ILM.
The package components shown in Figure 2-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor (die)
4. Package substrate
5. Capacitors
Note:
1. Socket and baseboard are included for reference and are not part of processor package.
Figure 2-1. Processor Package Assembly Sketch
LGA 2011-0 Socket
System Board
Capacitors
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