Thermal/Mechanical Specifications and Design Guide 39
LGA2011-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications
5 LGA2011-0 Socket and ILM
Electrical, Mechanical, and
Environmental Specifications
This chapter describes the electrical, mechanical, and environmental specifications for
the LGA2011-0 socket and the Independent Loading Mechanism.
5.1 Component Mass
Note:
1. This is an approximate mass.
5.2 Package/Socket Stackup Height
Ta b l e 5 - 2 provides the stackup height of a processor in the 2011-0-land LGA package
and LGA2011-0 socket with the ILM closed and the processor fully seated in the socket.
Notes:
1. This data is provided for information only, and should be derived from: (a) the height of the socket seating
plane above the motherboard after reflow, given in Appendix B, (b) the height of the package, from the
package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that
are given in the corresponding processor Datasheet listed in Tabl e 1 - 1 .
2. This value is a RSS calculation at 3 Sigma
Table 5-1. Socket and Retention Component Mass
Component Mass
Socket Body, Contacts and PnP Cover 25
1
g
Square ILM Assembly 82g
Backplate 84g
Table 5-2. 2011-land Package and LGA2011-0 Socket Stackup Height
Integrated Stackup Height
(mm)
From Top of Board to Top of IHS
8.014 ±0.34 mm
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