Thermal/Mechanical Specifications and Design Guide 37
Independent Loading Mechanism (ILM)
ILM cover features:
• Pre-assembled by the ILM vendors to the ILM load plate. It will also be offered as a
discrete component.
• The ILM cover will pop off if a processor is installed in the socket.
• ILM Cover can be installed while the ILM is open.
• Maintain inter-changeability between validated ILM vendors for LGA2011-0 socket.
• The ILM cover for the LGA2011-0 socket will have a flammability rating of V-0 per
UL 60950-1.
Note: Intel recommends removing the Pick and Place cover (PnP) of the socket body in
manufacturing as soon as possible at the time when ILM is being installed.
4.6 Heatsink to ILM interface
Heatsinks for processors in the LGA2011-0 socket attach directly to the ILM using M4
fasteners. Figure 4-15 shows the critical dimension features the thermal solution
vendor must meet.
Figure 4-14. ILM with Cover
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