Package Mechanical Specifications
18 Thermal/Mechanical Specifications and Design Guide
2.1.7 Processor Materials
Tab l e 2 -3 lists some of the package components and associated materials.
2.1.8 Processor Markings
Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
§ §
Table 2-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Halogen Free, Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 2-3. Processor Top-Side Markings
S/N
-0
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
Legend: Sample (QDF):
GRP1LINE1: i{M}{C}YY
GRP1LINE2: INTEL CONFIDENTIAL
GRP1LINE3: QDF ES SPEED
GRP1LINE4: XXXXX
GRP1LINE5: {FPO} {e4}
Legend: Production (SSPEC):
GRP1LINE1: i{M}{C}YY
GRP1LINE2: SUB-BRAND PROC#
GRP1LINE3: SSPEC SPEED
GRP1LINE4: XXXXX
GRP1LINE5: {FPO} {e4}
Lot #
Note: XXXXX = Country of Origin
To Next Page
Loading...
Need help?
General
