LGA2011-0 Socket
26 Thermal/Mechanical Specifications and Design Guide
3.4.5 Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in Appendix B.
Similarly, a seating plane on the topside of the socket establishes the minimum
package height. See Section 5.2 for the calculated IHS height above the motherboard.
3.5 Durability
The socket must withstand 30 cycles of processor insertion and removal. The maximum
part average and single pin resistances from Tab l e 5 - 4 must be met when mated in the
1st and 30th cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
3.6 Markings
There are three markings on the socket:
• LGA2011-0: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA2011-0 and the manufacturer's insignia are molded or laser marked on the side
wall.
3.7 Component Insertion Forces
Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for
Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment,
example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it
requires no force to insert the package into the socket.
3.8 Socket Size
Socket information needed for motherboard design is given in Appendix B.
This information should be used in conjunction with the reference motherboard keep-
out drawings provided in Appendix A to ensure compatibility with the reference thermal
mechanical components.
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