Thermal/Mechanical Specifications and Design Guide 97
Thermal Solutions
8 Thermal Solutions
This section describes the desktop reference heatsink, design targets for a radial fin
heatsink (DHR-A) and a tall heat pipe heatsink (T-HPHS) and thermal design guidelines
for the Intel
®
Core™ i7-3960X, i7-3970X processor Extreme Edition, Intel
®
Core™ i7-
3930K processor, and Intel
®
Core™ i7-3820 processor.
8.1 Performance Targets
Ta b l e 8 - 1 provides boundary conditions and performance targets for the reference
heatsinks. These values are used to generate processor thermal specifications and to
provide guidance for heatsink design.
All Boundary Conditions are specified at 35
o
C system ambient temperature and at sea
level.
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3) for thermal characterization parameter (Section 8.8.2).
3. The target Psi-ca as measured on the Thermal Test Vehicle (TTV).
,
8.1.1 Reference Heatsink Assembly
Table 8-1. Processor Reference Thermal Boundary Conditions
TDP Heatsink Technology
Ψ
CA
2, 3
(
o
C/W)
T
LA
1
(
o
C)
130W
T-HPHS
Tower (Cu/Al and Heatpipe)
0.199 39
130W
DRA-A
Cu Core Al Fins Al Radial Fin
0.214 39
Figure 8-1. Radial Fin Heatsink Assembly