Intel BX80619I73820

Thermal/Mechanical Specifications and Design Guide 3
Contents
1Introduction............................................................................................................ 11
1.1 References ....................................................................................................... 12
1.2 Definition of Terms ............................................................................................ 12
2 Package Mechanical Specifications .......................................................................... 15
2.1 Package Mechanical Specifications ....................................................................... 15
2.1.1 Package Mechanical Drawing.................................................................... 16
2.1.2 Processor Component Keep-Out Zones...................................................... 16
2.1.3 Package Loading Specifications ................................................................ 17
2.1.4 Package Handling Guidelines.................................................................... 17
2.1.5 Package Insertion Specifications............................................................... 17
2.1.6 Processor Mass Specification.................................................................... 17
2.1.7 Processor Materials................................................................................. 18
2.1.8 Processor Markings................................................................................. 18
3 LGA2011-0 Socket ................................................................................................... 19
3.1 Contact/Land Mating Location ............................................................................. 22
3.2 Board Layout .................................................................................................... 22
3.3 Attachment to Motherboard ................................................................................ 23
3.4 Socket Components........................................................................................... 24
3.4.1 Socket Body Housing .............................................................................. 24
3.4.2 Solder Balls ........................................................................................... 24
3.4.3 Contacts ............................................................................................... 24
3.4.4 Pick and Place Cover............................................................................... 24
3.4.5 Socket Standoffs and Package Seating Plane.............................................. 26
3.5 Durability ......................................................................................................... 26
3.6 Markings .......................................................................................................... 26
3.7 Component Insertion Forces ............................................................................... 26
3.8 Socket Size ...................................................................................................... 26
4 Independent Loading Mechanism (ILM)................................................................... 27
4.1 Square ILM Design Concept ................................................................................ 28
4.1.1 Square ILM Assembly Design Overview ..................................................... 28
4.2 ILM Features .................................................................................................... 30
4.2.1 ILM Closing sequence ............................................................................. 30
4.2.2 ILM Opening Sequence............................................................................ 31
4.2.2.1 ILM Keying............................................................................... 33
4.2.3 ILM Back Plate Design Overview............................................................... 33
4.3 ILM Assembly ................................................................................................... 34
4.3.1 Manufacturing Assembly Flow .................................................................. 34
4.4 Processor Installation......................................................................................... 35
4.5 ILM Cover ........................................................................................................ 36
4.6 Heatsink to ILM interface.................................................................................... 37
5 LGA2011-0 Socket and ILM Electrical, Mechanical, and
Environmental Specifications................................................................................... 39
5.1 Component Mass............................................................................................... 39
5.2 Package/Socket Stackup Height .......................................................................... 39
5.3 Loading Specifications........................................................................................ 40
5.4 Electrical Requirements...................................................................................... 40
5.5 Environmental Requirements .............................................................................. 41
6 Thermal Management Specifications........................................................................ 43
6.1 Package Thermal Specifications........................................................................... 43
6.1.1 Thermal Specifications ............................................................................ 43