Intel BX80619I73820 User Manual

Thermal Management Specifications
44 Thermal/Mechanical Specifications and Design Guide
6.1.2 TTV T
CASE
and DTS Based Thermal Specifications
To simplify compliance to thermal specifications at processor run time, the processor
has a Digital Thermal Sensor (DTS) based thermal specification. Digital Thermal Sensor
reports a relative die temperature as an offset from TCC activation temperature. See
Section 6.3 for additional discussion on the accessing DTS data vis the Platform
Environment Control Interface (PECI). A TTV Tcase thermal based specifications are
used for heat sink sizing and DTS based specifications are used for acoustic and fan
speed optimizations.
6.1.2.1 Thermal Specification
Notes:
1. The package C-state power is the worst case power in the system configured as follows:
- Memory configured for DDR3 1600 and populated with 1DIMM per channel.
- DMI and PCIe links are at L1.
2. Specification at DTS = -50 and minimum voltage loadline.
3. Specification at DTS = -50 and minimum voltage loadline.
4. Specification at DTS = -40 and minimum voltage loadline.
5. These DTS values (in Notes 2-4) are based on the TCC Activation MSR having a value of 100, see
Section 6.2.1.
6. These values are specified at V
CC_MAX
and V
NOM
for all other voltage rails for all processor frequencies.
Systems must be designed to ensure the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at specified ICC. Refer to the electrical loadline specifications in
the Datasheet. The Intel
®
Core™ i7-3960X, i7-3970X processor Extreme Edition, Intel
®
Core™ i7-3930K
processor, and Intel
®
Core™ i7-3820 processor may be delivered under multiple VIDs for each frequency.
7. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at DTS = -1.
8. These specifications are based on initial pre-silicon simulations, which will be updated as further
characterization data becomes available.
9. Not 100% tested. Specified by design characterization.
10. With 15M cache.
11. With 12M cache.
Table 6-1. Processor Thermal Specifications
Product
Max Power
Package
C1E
(W)
1,2,5,9
Max Power
Package
C3
(W)
1,3,5,9
Max Power
Package
C6
(W)
1,4,5,9
TTV
Thermal
Design
Power
(W)
6,7
Minimum
T
CASE
(°C)
Maximum
TTV
T
CASE
(°C)
6-Core
11
53 35
21
130 5
See
Figure 6-1;
Tab l e 6- 2
6-Core
12
53 25
4-Core 53 28 16

Intel BX80619I73820 Specifications

General

Brand	Intel
Model	BX80619I73820
Category	Computer Hardware
Language	English