Thermal/Mechanical Specifications and Design Guide 19
LGA2011-0 Socket
3 LGA2011-0 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the
processors in the Platform. The socket provides I/O, power and ground contacts. The
socket contains 2011 contacts arrayed about a cavity in the center of the socket with
lead-free solder balls for surface mounting on the motherboard.
The socket has 2011 contacts. The LGA2011-0 socket is introducing a hexagonal area
array ball-out which provides many benefits:
• Socket contact density increased by 12% while maintaining 40 mil minimum via
pitch requirements.
• Corresponding square pitch array’s would require a 38 mil via pitch for the same
package size.
LGA2011-0 has 1.016 mm (
40 mil) hexagonal pitch in a 58x43 grid array with
24x16 grid depopulation in the center of the array and selective depopulation
elsewhere.
Contact wiping direction is 180 degrees as shown in Figure 3-2.
Figure 3-1. Hexagonal Array in LGA2011-0
Table 3-1. LGA2011-0 Socket Attributes
LGA2011-0 Socket Attributes
Component Size 58.5 mm(L)X51 mm (W)
Pitch 1.016 mm (Hex Array)
Ball Count 2011
4
0
m
i
l
4
0
m
i
l
40 mil
34.7 mil
4
0
m
i
l
4
0
m
i
l
40 mil
34.7 mil
4
0
m
i
l
4
0
m
i
l
40 mil
34.7 mil
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