LGA2011-0 Socket
20 Thermal/Mechanical Specifications and Design Guide
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The design includes a back plate that is integral to having a
uniform load on the socket solder joints and the contacts. Socket loading specifications
are listed in Chapter 5. Schematic for LGA2011-0 socket is shown in Figure 3-3. The
seating plane is shown on the outer periphery of the socket.
Figure 3-2. Contact Wiping Direction
Contact Wiping DirectionContact Wiping DirectionContact Wiping Direction
Figure 3-3. Schematic of LGA2011-0 Socket with Pick and Place Cover Removed
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