LogTag TRIX-8 - SUMMARY FLOWCHART OF LOGTAG TRIX-8;TRIX-16 ASSEMBLY; MANUFACTURING PROCESS OVERVIEW; Manufacturing Phase 1: PCBA Assembly

LogTag TRIX-8/TRIX-16 Work Instruction Manual Revision 9.20 Page 3/53
CONTENTS
REVISION HISTORY ................................................................................................................................................... 2
CONTENTS .................................................................................................................................................................... 3
SUMMARY FLOWCHART OF LOGTAG TRIX-8/TRIX-16 ASSEMBLY ........................................................... 6
MANUFACTURING PHASE 1 : PCBA ASSEMBLY AND MOUNTING IN CASE ............................................................. 6
MANUFACTURING PHASE 2: PRODUCT ASSEMBLY & TEST .................................................................................... 7
MANUFACTURING PHASE 3: LABELLING & SHIPPING ........................................................................................... 8
1. MANUFACTURING PHASE 1 ............................................................................................................................ 9
1.1 SMD MOUNTING ..................................................................................................................................................... 9
Specific Components Required ................................................................................................................................. 9
Reference .................................................................................................................................................................. 9
Procedure ................................................................................................................................................................. 9
Special Notes ............................................................................................................................................................ 9
INSPECT .................................................................................................................................................................. 9
REFLOW TEMPERATURE ...................................................................................................................................... 9
HANDLING PROCEDURES ...................................................................................................................................... 9
1.2 CRYSTAL MOUNTING ............................................................................................................................................. 10
Procedure: .............................................................................................................................................................. 10
1.3 PCBA BOOT / LED FLASHING TEST ....................................................................................................................... 11
Reason of test stage: ............................................................................................................................................... 11
Equipment Required : ............................................................................................................................................. 11
Procedure ............................................................................................................................................................... 11
CORRECTIVE ACTION ......................................................................................................................................... 11
1.4 SEPARATE PCBAS FROM PANEL ........................................................................................................................... 12
1.5 TEST & CALIBRATE LOGTAG TRIX PCBA (TEST FIXTURE) .................................................................................. 13
Reason for test stage: ............................................................................................................................................. 13
Equipment required:- ............................................................................................................................................. 13
Setup for TRIX-8 PCBA testing .............................................................................................................................. 14
Setup for TRIX-16 PCBA testing ............................................................................................................................ 15
Procedure:- ............................................................................................................................................................ 16
CORRECTIVE ACTION ......................................................................................................................................... 16
1.6 MOUNTING IN CASE/ SWAGING INTERFACE CONTACTS RIVETS .............................................................................. 17
Equipment Required:- ............................................................................................................................................ 17
Procedure:- ............................................................................................................................................................ 17
Special Notes: ......................................................................................................................................................... 17
1.7 SOLDER ON ELECTRO-CAP .................................................................................................................................... 18
Procedure ............................................................................................................................................................... 18
Inspection ............................................................................................................................................................... 18
1.8 SOLDER ON THERMISTOR ....................................................................................................................................... 19
Equipment Required: .............................................................................................................................................. 19
Procedure ............................................................................................................................................................... 19
Visual Inspection .................................................................................................................................................... 20
1.9 CONFORMAL COAT OVER SENSOR ELECTRONICS ................................................................................................... 21
2. MANUFACTURING PHASE 2 .............................................................................................................................. 22
2.1 APPLY FOAM DOT TO UNDERSIDE OF BATTERY ...................................................................................................... 22
Items Required ........................................................................................................................................................ 22
Procedure ............................................................................................................................................................... 22
2.2 SOLDER ON BATTERY ............................................................................................................................................ 23
Procedure ............................................................................................................................................................... 23
Visual Inspection .................................................................................................................................................... 23
2.3 ADD SEALANT TO SENSOR AREA ............................................................................................................................ 24
Procedure: .............................................................................................................................................................. 24
Visual Inspection .................................................................................................................................................... 24
2.4 PRESS CASE HALVES TOGETHER............................................................................................................................. 25