LogTag TRIX-8 - MANUFACTURING PHASE 1; 1.1 SMD mounting; Specific Components Required; Reference

LogTag TRIX-8/TRIX-16 Work Instruction Manual Revision 9.20 Page 9/53
1. MANUFACTURING PHASE 1
The steps in manufacturing phase 1 produce product to a point where it is tested and assembled to a state
just prior to battery installation.
1.1 SMD mounting
Specific Components Required
• LogTag PCB 150306
• Paste stencil matching to PCB 150306.
• PIC16LC58BI/SO programmed with LogTag data logger firmware v1.40 as defined in APPENDIX 2.
• Paste type ‘NO-CLEAN’.
Reference
• Logtag 150306 component location maps for TRIX-8 or TRIX-16 (See APPENDIX 1A & 1B)
Procedure
• Place all SMD components as per 150306 component location map detailed in APPENDEX 1A & 1B for
the required version of TRIX (i.e TRIX-8 or TRIX-16)
Special Notes
• Note orientation of LEDs
• If a No-Clean type solder paste has not been used then the PCBA will require cleaning to remove the
flux residues. (CHECK that switch can be immersed for cleaning!)
• Ensure reflow temperature profile does not exceed profile required for LEDs.
• Pasted panels to be stored horizontally before reflow at all times.
INSPECT
Visual Inspection using illuminated magnifying glass to check quality of solder
joints after reflow. Joints must be shiny and correctly formed
REFLOW TEMPERATURE
Perform regular oven temperature profiles to insure reflow soldering profiles are optimum.
HANDLING PROCEDURES
• All operators wear gloves when handling components or PCBAs
• ESD wrist-straps which are correctly grounded must be worn at all times.
• Work benches and test jigs must be kept clean and tidy at all times.