4.2 Temperature Features ................................................................................................................ 68
4.3 ESD Protection ........................................................................................................................... 69
5 RF Features ............................................................................................. 70
5.1 Operating Bands ........................................................................................................................ 70
5.2 TX Power and RX Sensitivity ..................................................................................................... 71
5.3 GNSS Feature ............................................................................................................................ 72
6 Mechanical Features ............................................................................... 74
6.1 Dimensions ................................................................................................................................. 74
6.2 Label ........................................................................................................................................... 75
6.3 Pack ........................................................................................................................................... 75
6.3.1 Reel&Tape ......................................................................................................................... 75
6.3.2 Moisture ............................................................................................................................. 77
7 Mounting the Module onto the Application Board .................................... 78
7.1 Bottom Dimensions .................................................................................................................... 78
7.2 Application Foot Print ................................................................................................................. 79
7.3 Stencil ......................................................................................................................................... 79
7.4 Solder Paste ............................................................................................................................... 79
7.5 SMT Furnace Temperature Curve .............................................................................................. 80
8 Safety Recommendations ....................................................................... 81
Conformity and Compliance .................................................................... 82
A.1 Approvals ................................................................................................................................... 82
A.2 American Notice ......................................................................................................................... 82
A.2.1 Modify ................................................................................................................................ 82
A.2.2 FCC Class A Digital Device Notice ................................................................................... 82
A.2.3 FCC Class B Digital Device Notice ................................................................................... 82
Abbreviation ............................................................................................ 84
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