7.2 Application Foot Print
Figure 7-2 Recommended Application Foot Print (Top View)
7.3 Stencil
The recommended stencil thickness is at least 0.12 mm to 0.15 mm.
7.4 Solder Paste
The quality of the solder joint depends on the solder paste volume and the PCB flatness.
Do not use the kind of solder paste different from our module technique.
⚫
The melting temperature of solder paste with lead is 35 °C lower than that of solder paste
without lead. It is easy to cause voiding for LGA and LCC inside the module after second reflow
soldering.
⚫
When using only solder pastes with lead, please ensure that the reflow temperature is kept at
220 °C for more than 45 seconds and the peak temperature reaches 240 °C.
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