RL78/G13 CHAPTER 29 ELECTRICAL SPECIFICATIONS
R01UH0146EJ0100 Rev.1.00 994
Sep 22, 2011
Caution The pins mounted depend on the product. Refer to 2.1.1 20-pin products to 2.1.14 128-pin products,
and 2.1.15 Pins for each product (pins other than port pins).
Notes 1. Total current flowing into V
DD and EVDD0, including the input leakage current flowing when the level of the input
pin is fixed to VDD, EVDD0 or VSS, EVSS0. The values below the MAX. column include the peripheral operation
current (except for background operation (BGO)). However, not including the current flowing into the A/D
converter, LVD circuit, I/O port, and on-chip pull-up/pull-down resistors.
2. When high-speed on-chip oscillator and subsystem clock are stopped.
3. When high-speed system clock and subsystem clock are stopped.
4. When high-speed on-chip oscillator and high-speed system clock are stopped. When real-time counter and
watchdog timer is stopped. When AMPHS1 = 1 (Ultra-low power consumption oscillation).
5. Relationship between operation voltage width, operation frequency of CPU and operation mode is as below.
High speed operation: V
DD = 2.4 V to 5.5 V@1 MHz to 32 MHz
Low speed operation: VDD = 1.8 V to 5.5 V@1 MHz to 8 MHz
Low voltage operation: V
DD = 1.6 V to 5.5 V@1 MHz to 4 MHz
Remarks 1. f
MX: High-speed system clock frequency (X1 clock oscillation frequency or external main system clock
frequency)
2. f
IH: High-speed on-chip oscillator clock frequency
3. fSUB: Subsystem clock frequency (XT1 clock oscillation frequency)
4. Except subsystem clock operation, temperature condition of the TYP. value is T
A = 25°C
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