u-blox ANTARIS 4 - Processing

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5.3 Processing
5.3.1 Moisture Preconditioning
Bothencapsulantandsubstratematerialsabsorbmoisture.JEDECspecificationJ-STD-020mustbeobservedto
lrequirementsafteropeningthesealisopenedhasbeenexceeded,e.g.exposure
e
Rec m
Dur
Temperature: 125°C
Humidity: Below5%.Desiccantmustbeplacedintotheoventokeephumiditylow.
Oven: Convectionflow
oven.Alsoputdesiccantpackintotheovenfordehydration.
Afterwork: Putthebakedcomponentswithdesiccantandmoistureindicatorintoahumidityproofbagand
useavacuumhotbarriersealingmachineforsealingifnotprocessedwithinspecifiedfloortime.
Storageinanitrogencabinetordry
boxisalsoapossibleapproachtopreventmoistureintake.
! Warning DonotattempttobaketheANTARIS
®
4 GPSModulescontainedintapeandrolledupinreels.Ifyou
need to bake the ANTARIS
®
4 GPS Modules quickly at 125°C for 48 hours, remove them from the
beltandplacethemindividuallyontotheoventray.
 Note Arepeatedbakingprocesswillreducethewettingeffectivenessofthepadcontacts.Thisappliesto
allSMTdevices.
5.3.2 Soldering Paste
prevent cracking and delamination associated with the "popcorn" effect during solder reflow. The popcorn
effectcanbedescribedasminiatureexplosionsofevaporatingmoisture.Bakingbeforeprocessingisrequiredin
followingcases:
• Humidityindicatorcard:At
leastonecircularindicatorisnolongerblue
• Floorlifeorenvironmenta
to xcessiveseasonalhumidity.
om ended baking procedure:
ation: 48hours
Useof"NoClean"solderingpasteisstronglyrecommended,asitdoesnotrequirecleaningafterthesoldering
processhastakenplace.Thepastelistedintheexamplebelowmeetsthesecriteria.
Ltd.)
StencilThickness: 150µmforbaseboards
dsontheapprovedmanufacturingprocedures.
The t mendationsinsection3.6.2.
 Note
on the connectors (’half vias’) should meet the appropriate IPC
specification.
SolderingPaste: LFSOLDERTLF-206-93F(TamuraKaken(UK)
Alloyspecification: Sn95.5/Ag3.9/Cu0.6(95.5%Zinc/0.6
%Silver/0.6%Copper)
MeltingTemperature: 216-221°C
Thefinalchoiceofthesolderingpastedepen
pas e-maskgeometryforapplyingsolderingpasteshouldmeettherecom
The quality of the solder joints

GPSModules-SystemIntegrationManual(SIM)(incl.ReferenceDesign) ProductHandling
GPS.G4-MS4-05007-A1
  Page 128