your position is our focus
Preheat
0
50
100 150 200 250 300
50
100
150
200
250
Heating Cooling
[°C]
100
150
200
250
Peak Temp.
230 - 250 °C
Liquidus Te
max 1- 4 °C/s
max 60 - 120 s
mperature
116 - 221
Elapsed Time [s]
max 20 - 40 s
Typical Leadfree
Soldering Profile
End Temp.
150 - 200 °C
Typical Leaded
Soldering Profile
50
max 3 °C/s
[°C]
) modules in a leaded process, check the following
andard leads process
dw
tocheckwhether:
• Allpadsareproperlysoldered
• Noexcesssolderhascreatedcontactstoneighboringpads,orpossiblytopadstacksandviasnearby.
Figure 102: Recommended soldering profile
Note When soldering leadfree (ANTARIS
®
4
temperatures:
• PB-TechnologySoaktime: 40-80sec
• TimeaboveLiquidus: 40-90sec
• Peaktemperature: 225-235°C
ThesePeaktemperatures is around10 degree igher thanthe recomme h nded st
®
onANTARIS
products.
re .
Note TheANTARIS
®
modulesmustnotbesolde ithadampheatprocess
5.3.4 Optical Inspection
AftersolderingtheANTARIS 4GPSModule,consideranopticalinspection
®
step
• ANTARIS
®
4GPSModuleisproperlyalignedandcenteredoverthepads
GPSModules-SystemIntegrationManual(SIM)(incl.ReferenceDesign) ProductHandling
GPS.G4-MS4-05007-A1
Page 130