your position is our focus
5.3.5 Cleaning
ly discouraged.Residuals, which are underneath the
®
bedinthegapbetweenthebaseboard
and the ANTARIS
®
4 GPS Module.The combination of residuals of soldering flux and encapsulated water
s ns between neighboring pads. Water will also damage
thestickerandtheink-jetprintedtext.
ring flux residuals into the
two
accessible for post-washing inspection. The solvent will also damage the
xt.
• UltrasoniccleaningwilldamageanANTARIS
®
4GPSReceiverpermanently,inparticularthequartzoscillators.
The best approach is to consider using a "no clean" soldering paste and eliminate the cleaning step past the
soldering.
5.3.6 Repeated Reflow Soldering
boardswithanANTARIS
®
4GPSModulepopulatedonit.
Reason:Riskoffallingoffduetohighweightinrelationtotheadhesivepropertiesofthesolder.
5.3.7 Wave Soldering
Bas
dev
enc
SModulepopulatedonit.
out sIPC7711.
c
and
The ANTARIS
®
4 GPS Module can be unsoldered from the baseboard.Use desoldering braid made of copper.
AvoidoverheatingtheANTARIS
®
4GPSModules.
thegapbelowthemodule.
Afterallsolderhasbeenremovedfromallpads,liftthecomponentcarefully.Continueunsolderingcarefullyif
the ANTARIS
®
4 GPS Module does still stick.After the module is removed, clean the pads before placing and
hand-solderinganewmodule.
! Warning Neverattemptareworkonthemoduleitself,e.g.replacingindividualcomponents.Suchactionswill
terminatewarrantycoverageimmediately.
In general, cleaning the populated modules is strong
ANTARIS
4GPSModules,cannotberemovedeasilywithawashingprocess.
• Cleaningwithwaterwillleadtocapillaryeffectswherewaterisabsor
lead to short circuits or resistor-like interconnectio
• Cleaning with alcohol or a similar organic solvent will likely flood solde
housings, which is a place not
stickerandtheink-jetprintedte
Onlyasinglereflowsolderingprocessisencouragedfor
e boards with combined through-hole technology (THT) components and surface-mount technology (SMT)
ices require a wave soldering to solder the THT components. Only a single wave soldering process is
ouragedforboardswithanANTARIS
®
4GP
5.3.8 Hand Soldering
Handsolderingisallowed.UseaSolderingirontemperaturesetting"7"whichisequivalentto350°Candcarry
thehandsolderingaccordingtotheIPCrecommendations/referencedocument
Pla etheANTARIS
®
4GPSModulepreciselyonthepads.Startwithacross-diagonalfixturesoldering(e.g.pins1
16),andthencontinuefromlefttoright.
5.3.9 Rework
Avacuumsoldersuckerisnotrecommendedassolderresidualsmayremainin
GPSModules-SystemIntegrationManual(SIM)(incl.ReferenceDesign) ProductHandling
GPS.G4-MS4-05007-A1
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