u-blox ANTARIS 4 User Manual

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5.3.3 Reflow Soldering
A convection type-soldering oven is strongly recommended over the infrared type radiation oven.
Convection heated ovens allow precise control of the temperature and all parts will be heated up evenly,
regardlessofmaterialproperties,thicknessofcompon

entsandsurfacecolor.
Consider the "IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave) processes,
onent leads andballs. Residual humidity will be dried out.Please note that this preheat
pha
• temperaturer itmaycause
excessiveslumping.
e:60–
120seconds If the preheat is i  to be
ely, if performed excessively, fine balls and large
tedinclusters.
caused in
areascontaininglargeheat
capacity.
Thetemperaturerisesabovetheliquidustemperatureof216-221°C.Avoidasuddenriseintemperatureasthe
• Peakreflowtemperature:230-250°C
 brittle) of the solder and
e mechanical tensions in the products.Controlled cooling helps to achieve bright solder fillets with a
ape
• Tempe ax3°C/s

 ote Toavoidfallingoff,theANTARIS
®
4 GPSModuleshouldbeplacedonthetopsideofthemotherboard
duringsoldering.
The final soldering temperature chosen at the factory depends on additional external factors like choice of
soldering paste, size, thickness and properties of the base board, etc.Exceeding the maximum soldering
temperatureintherecommendedsolderingprofile
maypermanentlydamagethemodule.
published2001".
Preheat Phase
Initial heating of comp
sewillnotreplacepriorbakingprocedures.
Temperatureriserate:1-4°C/s Ifthe iseistoorapidinthepreheatphase
• Tim
nsufficient, rather large solder balls tend
generated. Convers
ballswillbegenera
• EndTemperature:150-200°C If the temperature is too low, non-melting tends to be
Heating/ Reflow Phase
slumpofthepastecouldbecomeworse.
• Limittimeabove220°Cliquidustemperature:20-40s
Cooling Phase
A controlled cooling avoids negative metallurgical
effects (solder becomes more
possibl
goodsh andlowcontactangle.
raturefallrate:m
N
GPSModules-SystemIntegrationManual(SIM)(incl.ReferenceDesign) ProductHandling
GPS.G4-MS4-05007-A1
  Page 129

u-blox ANTARIS 4 Specifications

General

Brand	u-blox
Model	ANTARIS 4
Category	GPS
Language	English