your position is our focus
4. ce
4. st
4.10 DeadReckoningenabledGPSmodule(DRmodule).......................................................................... 123
5
5. ck
5.
8 Re iverConfiguration ..................................................................................................................... 115
4.8.1 ConfigurationConcept.............................................................................................................. 115
4.8.2 GPSMODEPinConfiguration(ROMonly/LowCostReceivers).................................................. 118
9 Sy emFunctions.............................................................................................................................. 1 21
4.9.1 ResetOptions............................................................................................................................ 121
4.9.2 RESET_N-Resetsignalgenerationanduse................................................................................ 121
4.9.3 BOOT_INT–BootModeSelection .............................................................................................. 122
4.9.4 EXTINT-ExternalInterruptPin................................................................................................... 122
4.9.5 SystemMonitoring.................................................................................................................... 123
Product Handling......................................................................................................124
1 Pa aging......................................................................................................................................... 124
5.1.1 Reels ......................................................................................................................................... 124
5.1.2 Tapes ........................................................................................................................................ 125
2 Shipment,StorageandHandling ............................................................................................... 125
5.2.1 Handling ................................................................................................................................... 125
5.2.2 Shipment ........................................................................................................................... 125
5.2.3 Storage ..................................................................................................................................... 126
5.2.4 Handling ................................................................................................................................... 126
5.2.5 FloorLi .................................................................................................................................. 127 fe .
5. oc3 Pr essing ................................................................................................................................. 128
5.3.1 MoisturePreconditioning .......................................................................................................... 128
5.3.2 SolderingPaste ................................................................................................................. 128 .
5.3.3 ReflowSoldering ................................................................................................................ 129
5.3.4 OpticalInspection...................................................................................................................... 130
5.3.5 Cleaning.................................................................................................................................... 131
5.3.6 RepeatedReflowSoldering........................................................................................................ 131
5.3.7 WaveSoldering ......................................................................................................................... 131
5.3.8 HandSoldering ......................................................................................................................... 131
5.3.9 Rework...................................................................................................................................... 131
5.3.10 ConformalCoating ................................................................................................................... 132
5.3.11 Casting...................................................................................................................................... 132
5.3.12 GroundingMetalCovers ........................................................................................................... 132
5.3.13
6
UseofanyUltrasonicProcesses ................................................................................................. 132
Product Testing.........................................................................................................133
6.1 u-bloxIn-SeriesProductionTest ................................................................................................. 133
GPSModules-SystemIntegrationManual(SIM)(incl.ReferenceDesign) Contents
GPS.G4-MS4-05007-A1
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