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Lenovo ThinkSystem SR645 V3 - Thermal Rules

Lenovo ThinkSystem SR645 V3
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Table 17. Recommended slot installation priority for PCIe adapters (continued)
Recommen-
ded slot
installation
priority
PCIe adapters
Maximum
supported
number
Slot 1 > Slot 2
> Slot 3
OCP module:
ThinkSystem Broadcom 5719 1GbE RJ45 4-port PCIe Ethernet Adapter
1 and
2
ThinkSystem Intel X710-T2L 10GBASE-T2-port OCP Ethernet Adapter
Network adapter:
ThinkSystem Broadcom 57414 10/25GbE SFP28 2-port PCIe Ethernet
Adapter
1
ThinkSystem Intel X710-T4L 10GBase-T 4-Port PCIe Ethernet Adapter
1
ThinkSystem Broadcom 57454 10GBASE-T 4-port PCIe Ethernet Adapter
ThinkSystem Intel E810-DA2 10/25GbE SFP28 2-Port PCIe Ethernet
Adapter
ThinkSystem Mellanox ConnectX-6 Lx 10/25GbE SFP28 2-port PCIe
Ethernet Adapter
1
3
Notes:
1. Two processors should be installed.
2. This adapter cannot be installed into LP-FH riser cage.
Thermal rules
This topic provides thermal rules for the server.
Server models with front drive bays only
This section provides thermal information for server models with front drive bays only.
Notes:
TDP is short for Thermal Design Power.
For 4 x 2.5" NVMe front bay without front I/O module, the following requirements should be met:
The 1U performance heat sink can only be used when:
The ambient temperature is equal to or less than 25°C.
Only processor 9654 or 9654P can be used.
Only one processor can be installed, and the processor TDP should be equal to or less than 360
watts.
Rear hard disk drive or GPU is not installed.
Direct Attach Cables (DAC) is supported when the bandwidth of PCIe adapter or OCP module is more
than 100 GB.
Front
bays
Max. Ambient
Temp. (at sea level)
Processor TDP
(watts)
Heat sink Fan type Max.
DIMM
Qty.
8 x
2.5"
35°C 200 ≤ TDP 240 1U performance Performance 24
30°C 200 ≤ TDP 240 1U performance Standard/
Performance
24
Chapter 5. Hardware replacement procedures 43

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