Phytec phyFLEX-i.MX 6 - Handling the Phyflex-I.MX 6

phyFLEX
®
-i.MX 6 [PFL-A-XL1-xxx
74  PHYTEC Messtechnik GmbH 2013 L-773e_2
17.2 Handling the phyFLEX-i.MX 6
 Modifications on the phyFLEX Module
Removal of various components, such as the microcontroller and the
standard quartz, is not advisable given the compact nature of the
module. Should this nonetheless be necessary, please ensure that the
board as well as surrounding components and sockets remain
undamaged while de-soldering. Overheating the board can cause the
solder pads to loosen, rendering the module inoperable. Carefully heat
neighboring connections in pairs. After a few alternations,
components can be removed with the solder-iron tip. Alternatively, a
hot air gun can be used to heat and loosen the bonds.
Caution!
If any modifications to the module are performed, regardless of their
nature, the manufacturer guarantee is voided.
 Integrating the phyFLEX into a Target Application
Successful integration in user target circuitry greatly depends on the
adherence to the layout design rules for the GND connections of the
phyFLEX module. For maximum EMI performance we recommend as
a general design rule to connect all GND pins to a solid ground plane.
But at least all GND pins neighboring signals which are being used in
the application circuitry should be connected to GND.
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