Phytec phyFLEX-i.MX 6 - Table 1: Signal Types Used in this Manual

Conventions, Abbreviations and Acronyms
 PHYTEC Messtechnik GmbH 2013 L-773e_2
vii
ETHERNET
Input
Differential line pairs 100 Ohm
Ethernet level input
ETH_I
ETHERNET
Output
Differential line pairs 100 Ohm
Ethernet level onput
ETH_O
ETHERNET
IO
Differential line pairs 100 Ohm
Ethernet level bidirectional
input/output
ETH_I/O
PCIe Input Differential line pairs 100 Ohm PCIe
level input
PCIe_I
PCIe Output Differential line pairs 100 Ohm PCIe
level output
PCIe_O
MLB Output Differential line pairs 100 Ohm Media
local bus output
MLB_O
MLB IO Differential line pairs 100 Ohm Media
local bus bidirectional input/output
MLB_I/O
MIPI CSI-2
Inpu
t
Differential line pairs 100 Ohm MIPI
CSI-2 level inpu
t
CSI-2_I
Table 1: Signal Types used in this Manual
Abbreviations and Acronyms
Many acronyms and abbreviations are used throughout this manual.
Use the table below to navigate unfamiliar terms used in this
document.
Abbreviation Definition
BSP Board Support Package (Software delivered with the
Development Kit including an operating system
(Windows, or Linux) preinstalled on the module and
Development Tools).
CB Carrier Board; used in reference to the phyFLEX
Development Kit Carrier Board.
DFF D flip-flop.
EMB External memory
b
us.
EMI Electromagnetic Interference.
GPI General purpose input.
GPIO General purpose input and output.
GPO General purpose output.
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.