Publication 2094-UM001A-EN-P — September 2006
Planning the Kinetix 6000 Drive System Installation 29
Bonding Multiple Subpanels
Bonding multiple subpanels creates a common low impedance exit
path for the high frequency energy inside the cabinet. Subpanels that
are not bonded together may not share a common low impedance
path. This difference in impedance may affect networks and other
devices that span multiple panels.
Multiple Subpanels and Cabinet Recommendations
Bond the top and bottom of each subpanel to the cabinet using
25.4 mm (1.0 in.) by 6.35 mm (0.25 in.) wire braid.
Scrape the paint around each fastener to
maximize metal to metal contact.
Cabinet ground bus
bonded to the subpanel.
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