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2. Overview
This chapter describes the system's features, configuration, and specifications.
2-1. Introduction
This system has been designed for plasma generation in RF sputtering, plasma CVD, etching, and
other plasma processing applications. This system combines an RF Generator and matching box. It
can continuously output its rated power at a single frequency of 13.56 MHz for high frequency loads.
This system also has a control terminal that makes external control by a PLC possible.
2-2. Features
Saves energy through a construction with an RF circuit featuring good power conversion
efficiency.
Maintainability has been markedly improved by creating a small and light weight system.
High-speed auto-matching is possible with with high-speed algorithm.
The system can be controlled in various ways through external analog control, serial
communication control, and the controller.
Our accumulated knowledge as an equipment manufacturer has been reflected in the design of
the system.
A stabilized oscillation frequency can be obtained with the quartz crystal oscillation system.
Accurate power can be read by the linearized power meter.