9 Lifecycle HIMax System
HI 801 001 E Rev. 4.01 Page 104 of 122
Figure 25: Securing the Connector Board with Captive Screws
9.1.6 Considerations about Heat
The increased integration level of electronic components causes a corresponding lost heat.
This depends on the external load of HIMax modules. Depending on the structure, the
device installation and ventilation are thus of importance.
Observe the environmental requirements when mounting the devices. Low operating
temperature increases the product life and the reliability of the electronic components within
the systems.
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