Thermal/Mechanical Specifications and Design Guide 5
7.1.7.2 Completion Codes ..................................................................... 93
7.1.8 Originator Responses.............................................................................. 94
7.1.9 DTS Temperature Data ........................................................................... 95
7.1.9.1 Format .................................................................................... 95
7.1.9.2 Interpretation........................................................................... 95
7.1.9.3 Reserved Values ....................................................................... 96
8Thermal Solutions................................................................................................... 97
8.1 Performance Targets.......................................................................................... 97
8.1.1 Reference Heatsink Assembly .................................................................. 97
8.2 Assembly Process for Reference Heatsinks ............................................................ 98
8.3 Geometric Envelope for the Intel® Reference ATX Thermal Mechanical Design........... 99
8.4 Structural Considerations ................................................................................. 100
8.5 Attachment to the ILM ..................................................................................... 100
8.6 Thermal Interface Material................................................................................ 100
8.7 Tall Heat Pipe Heat Sink Performance................................................................. 101
8.8 Thermal Design Guidelines ............................................................................... 102
8.8.1 Intel® Turbo Boost 2 Technology ........................................................... 102
8.8.2 Thermal Characterization Parameter ....................................................... 102
8.8.3 Fan Speed Control................................................................................ 103
9 Quality and Reliability Requirements ..................................................................... 105
9.1 Use Conditions................................................................................................ 105
9.2 Intel
®
Reference Component Validation.............................................................. 106
9.2.1 Board Functional Test Sequence ............................................................. 106
9.2.2 Post-Test Pass Criteria Examples ............................................................ 107
9.2.3 Recommended BIOS/Processor/Memory Test Procedures ........................... 107
9.3 Material and Recycling Requirements ................................................................. 107
A Mechanical Drawings............................................................................................. 109
B Socket Mechanical Drawings ................................................................................. 113
C Component Suppliers............................................................................................. 119
D Package Mechanical Drawings ............................................................................... 121
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