Sec 2: 8-22 Disassembly/Reassembly Procedures: Serviceable Components of the Main Sub-Assemblies
8.8.5.2 Thermal Pads
1. Scrape off both thermal pads (33, 34) from the amplifiers and/or Main chassis with the Black
Stick.
2. Ensure there are no debris or residue left on the amplifier's surfaces.
3. Replace with new thermal pads.
4. Peel off the back liner from the thermal pads.
5. Insert the Outer Thermal Pad (33) into the shield opening. Make sure the bottom surface of
the pad is mating with the top surface of the amplifiers.
6. Insert the Inner Thermal Pad (34) without compressing or deforming it.
NOTE: There are no other serviceable components on the RF Board Assembly.
8.8.6 Servicing of Expansion Board Assembly
1. Complete steps 8.7.1 through 8.7.3 of Section “8.7 Radio Disassembly” on page 2:8-11.
Figure 8-32. Expansion Board Assembly
NOTE: There are no serviceable components on the Expansion Board Assembly.
Thermal pads should always be replaced when RF Board
assembly is removed.
Expansion Board Assembly (C)
To Next Page
Loading...
