Figure 9-3 Oven temperature profile
Technical parameters:
⚫
Ramp up rate: 1 to 4°C/sec
⚫
Ramp down rate: -3 to -1°C/sec
⚫
Soak zone: 150 - 180°C, Time: 60 - 100s
⚫
Reflow zone: >220°C, Time: 40 - 90s
⚫
Peak temperature: 235 - 245°C
For information about cautions in storage and mounting, refer to
Neoway_Reflow_Soldering_Guidelines_For_Surface-Mounted_Modules.
When manually desoldering the module, use heat guns with great opening, adjust the temperature to
245°C (depending on the type of the solder paste), and heat the module till the solder paste is melted.
Then remove the module using tweezers. Do not shake the module at high temperatures while
removing it. Otherwise, the components inside the module might get misplaced.
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