Do you have a question about the Neoway N715-EA and is the answer not in the manual?
Defines the document's applicability, purpose, and intended readers.
Lists revisions and updates made to the document over time.
Explains the meaning of symbols used for danger, caution, and notes.
Advises on safe usage in hazardous environments and design/handling precautions.
Introduces the module, its features, applications, and illustrates its functional units.
Lists physical features like dimensions, package type, and weight.
Details physical characteristics such as dimensions, package type, and weight.
Covers temperature, voltage, current, processor, memory, band, and wireless rate.
Lists various interfaces, AT commands, protocols, and certification status.
Lists technical standards and specifications the module adheres to for compliance.
Shows the physical arrangement of pins on the N715-EA module, including pin conflicts.
Explains IO types and voltage level features for different interfaces.
Details pins for power supply, control signals like RESET_N and PWRKEY_N.
Lists pins for status indications and UART1 communication signals.
Details pins for UART2, debug interface, and USIM card connections.
Covers pins related to USB connectivity and Analog-to-Digital Converter interfaces.
Details pins for SDIO interface and SPI communication protocols.
Lists pins for LCD display and camera module interfaces.
Covers pins for audio output, RF control, flashlight driver, and microphone input.
Details pins for headset interface, general purpose I/O, and keypad inputs.
Lists key output pins, antenna interfaces, and other miscellaneous interface pins.
Describes sensing pins and reserved pins for future use or specific functions.
Covers power supply signals (VBAT, VDD_1P8) and their functions.
Discusses voltage drops, capacitor requirements, and power supply design for the module.
Presents circuit designs for power supply voltage regulation and filtering.
Offers circuit designs for different input voltage ranges and component selection.
Provides guidelines for PCB layout of power supply circuits, including trace width and grounding.
Details the VDD_1P8 output and control pins like PWRKEY_N and RESET_N.
Explains power-on using a button or MCU, with reference circuit designs.
Illustrates the power-on timing and sequence when controlled by an MCU.
Describes automatic power-on circuits and methods for powering off the module.
Details power-off via PWRKEY_N and the reset functionality using the RESET_N pin.
Provides reference designs for resetting the module using a button or an MCU.
Describes the USB interface, its pins, and capabilities for download and communication.
Offers design guidelines for the USB interface, including EMI and ESD considerations.
Details the three UART interfaces and provides a reference connection diagram.
Explains using translator chips for UART voltage-level conversion at high baud rates.
Presents dual-triode circuits for UART voltage-level translation at lower baud rates.
Describes the USIM interface, its power output, and data lines for USIM1.
Shows reference designs for USIM card interfaces and notes hardware conflicts.
Provides schematic and PCB design guidelines for USIM interfaces, including ESD and detection.
Introduces the SDIO interface for connecting external WLAN chips and its design considerations.
Explains SDIO signal multiplexing for SD card interface and its voltage support.
Presents the reference design for the SD card interface and PCB layout guidelines.
Details the PCM interface, its reference design, and schematic/PCB guidelines.
Describes SPI and I2C interfaces, their modes, and reference designs.
Covers the MIC interface, its pins, and reference design for differential input.
Details the EAR and SPK interfaces for audio output, including power amplifier considerations.
Provides reference designs for audio output with and without an external power amplifier.
Shows how to connect the module to an external audio power amplifier.
Lists the pins for the headset interface, including MIC and headphone connections.
Illustrates common headphone jack pin definitions (Type A and B).
Describes the LCD-dedicated SPI interface, frame rates, and pin descriptions.
Details the camera-dedicated SPI interface, frame rates, and pin descriptions.
Explains antenna interface types, matching networks, and ESD protection for RF.
Provides guidelines for RF PCB design, layout, and component placement.
Describes methods for antenna assembly, including RF connectors and cable connections.
Shows layout examples for 2.4 GHz chip antennas and ground area considerations.
Describes the two GPIO interfaces and their interrupt capabilities.
Details pins with multiplexing functions, including UART, SDIO, USIM, and SPI/FLASH.
Clarifies USIM2 interface usage and pin multiplexing, referencing section 4.2.
Describes the four ADC channels, their voltage ranges, and precision.
Explains the WAKEUP_IN pin for sleep mode control and its use with AT commands.
Details sleep mode process and status indication pins like NET_MODE, SLEEP_IND, NET_LIGHT.
Describes the USB_BOOT pin for emergency download and keypad input pins.
Details key output pins and the PSM interface for wake-up.
Covers input/output voltage, current consumption, and power supply requirements.
Lists operating, extended, and storage temperature ranges for the module.
Details ESD protection capabilities for various test points of the module.
Lists the supported GSM, FDD-LTE, and TDD-LTE operating bands.
Presents transmit power and receiving sensitivity data for various LTE bands.
Details TX power and RX sensitivity for WLAN and Bluetooth operations.
Shows the physical dimensions of the N715-EA module.
Illustrates the laser-etched label format on the N715-EA module.
Describes packaging methods for moisture protection and reel tape dimensions.
Explains MSL requirements and handling precautions for the module.
Shows the bottom view of the N715-EA PCB package for mounting.
Provides the recommended application PCB package layout and design considerations.
Details recommended stencil thickness and solder paste types for production.
Presents the oven temperature profile and technical parameters for SMT reflow soldering.
Lists common abbreviations from AI to ISP with their full names.
Lists common abbreviations from LGA to VBAT with their full names.
Defines the document's applicability, purpose, and intended readers.
Lists revisions and updates made to the document over time.
Explains the meaning of symbols used for danger, caution, and notes.
Advises on safe usage in hazardous environments and design/handling precautions.
Introduces the module, its features, applications, and illustrates its functional units.
Lists physical features like dimensions, package type, and weight.
Details physical characteristics such as dimensions, package type, and weight.
Covers temperature, voltage, current, processor, memory, band, and wireless rate.
Lists various interfaces, AT commands, protocols, and certification status.
Lists technical standards and specifications the module adheres to for compliance.
Shows the physical arrangement of pins on the N715-EA module, including pin conflicts.
Explains IO types and voltage level features for different interfaces.
Details pins for power supply, control signals like RESET_N and PWRKEY_N.
Lists pins for status indications and UART1 communication signals.
Details pins for UART2, debug interface, and USIM card connections.
Covers pins related to USB connectivity and Analog-to-Digital Converter interfaces.
Details pins for SDIO interface and SPI communication protocols.
Lists pins for LCD display and camera module interfaces.
Covers pins for audio output, RF control, flashlight driver, and microphone input.
Details pins for headset interface, general purpose I/O, and keypad inputs.
Lists key output pins, antenna interfaces, and other miscellaneous interface pins.
Describes sensing pins and reserved pins for future use or specific functions.
Covers power supply signals (VBAT, VDD_1P8) and their functions.
Discusses voltage drops, capacitor requirements, and power supply design for the module.
Presents circuit designs for power supply voltage regulation and filtering.
Offers circuit designs for different input voltage ranges and component selection.
Provides guidelines for PCB layout of power supply circuits, including trace width and grounding.
Details the VDD_1P8 output and control pins like PWRKEY_N and RESET_N.
Explains power-on using a button or MCU, with reference circuit designs.
Illustrates the power-on timing and sequence when controlled by an MCU.
Describes automatic power-on circuits and methods for powering off the module.
Details power-off via PWRKEY_N and the reset functionality using the RESET_N pin.
Provides reference designs for resetting the module using a button or an MCU.
Describes the USB interface, its pins, and capabilities for download and communication.
Offers design guidelines for the USB interface, including EMI and ESD considerations.
Details the three UART interfaces and provides a reference connection diagram.
Explains using translator chips for UART voltage-level conversion at high baud rates.
Presents dual-triode circuits for UART voltage-level translation at lower baud rates.
Describes the USIM interface, its power output, and data lines for USIM1.
Shows reference designs for USIM card interfaces and notes hardware conflicts.
Provides schematic and PCB design guidelines for USIM interfaces, including ESD and detection.
Introduces the SDIO interface for connecting external WLAN chips and its design considerations.
Explains SDIO signal multiplexing for SD card interface and its voltage support.
Presents the reference design for the SD card interface and PCB layout guidelines.
Details the PCM interface, its reference design, and schematic/PCB guidelines.
Describes SPI and I2C interfaces, their modes, and reference designs.
Covers the MIC interface, its pins, and reference design for differential input.
Details the EAR and SPK interfaces for audio output, including power amplifier considerations.
Provides reference designs for audio output with and without an external power amplifier.
Shows how to connect the module to an external audio power amplifier.
Lists the pins for the headset interface, including MIC and headphone connections.
Illustrates common headphone jack pin definitions (Type A and B).
Describes the LCD-dedicated SPI interface, frame rates, and pin descriptions.
Details the camera-dedicated SPI interface, frame rates, and pin descriptions.
Explains antenna interface types, matching networks, and ESD protection for RF.
Provides guidelines for RF PCB design, layout, and component placement.
Describes methods for antenna assembly, including RF connectors and cable connections.
Shows layout examples for 2.4 GHz chip antennas and ground area considerations.
Describes the two GPIO interfaces and their interrupt capabilities.
Details pins with multiplexing functions, including UART, SDIO, USIM, and SPI/FLASH.
Clarifies USIM2 interface usage and pin multiplexing, referencing section 4.2.
Describes the four ADC channels, their voltage ranges, and precision.
Explains the WAKEUP_IN pin for sleep mode control and its use with AT commands.
Details sleep mode process and status indication pins like NET_MODE, SLEEP_IND, NET_LIGHT.
Describes the USB_BOOT pin for emergency download and keypad input pins.
Details key output pins and the PSM interface for wake-up.
Covers input/output voltage, current consumption, and power supply requirements.
Lists operating, extended, and storage temperature ranges for the module.
Details ESD protection capabilities for various test points of the module.
Lists the supported GSM, FDD-LTE, and TDD-LTE operating bands.
Presents transmit power and receiving sensitivity data for various LTE bands.
Details TX power and RX sensitivity for WLAN and Bluetooth operations.
Shows the physical dimensions of the N715-EA module.
Illustrates the laser-etched label format on the N715-EA module.
Describes packaging methods for moisture protection and reel tape dimensions.
Explains MSL requirements and handling precautions for the module.
Shows the bottom view of the N715-EA PCB package for mounting.
Provides the recommended application PCB package layout and design considerations.
Details recommended stencil thickness and solder paste types for production.
Presents the oven temperature profile and technical parameters for SMT reflow soldering.
Lists common abbreviations from AI to ISP with their full names.
Lists common abbreviations from LGA to VBAT with their full names.
| Brand | Neoway |
|---|---|
| Model | N715-EA |
| Category | Network Hardware |
| Language | English |