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Xilinx Zynq-7000 Design Guide

Xilinx Zynq-7000
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Zynq-7000 PCB Design Guide www.xilinx.com 58
UG933 (v1.8) November 7, 2014
Chapter 5: Processing System (PS) Power and Signaling
Unused DDR pins should be connected as shown in Table 5- 5 .
For designs utilizing single-ended DQS, connect the DQS signal to DQS_P. DQS_N can either
be connected to the DQS_B I/O of the SDRAM, or via resistor divider to VCCO/2.
Dynamic Memory Implementation
Figure 5-5, Figure 5-6 and Figure 5-7 show examples of implementing DDR memory on
typical boards.
DDR_DQ[31:0] I/O Data
DDR_DM[3:0] O Data mask
DDR_DQS_P[3:0] I/O Differential data strobe positive
DDR_DQS_N[3:0] I/O Differential data strobe negative
DDR_VRP I/O Used to calibrate input termination
DDR_VRN I/O Used to calibrate input termination
DDR_VREF[1:0] I/O Reference voltage
Table 5-5: DDR Unused Pins
Unconnected Pins Comments
DDR Unused Pins, x16 non-ECC
O Unconnected
DQ/DQS IO Unconnected, internal pull-up by software
IO Unconnected, internal pull-up by software
DDR Unused Pins, x16 ECC
O Unconnected
DQ/DQS IO Connect to SDRAM
Other IO Unconnected, internal pull-up by software
Table 5-4: DDR Interface Signal Pins (Contd)
Pin Name Direction Description
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Xilinx Zynq-7000 Specifications

General IconGeneral
SeriesZynq-7000
Number of CoresDual-core
Processor SpeedUp to 1 GHz
Device TypeSoC
Logic CellsUp to 350K
DSP SlicesUp to 900
External Memory InterfacesDDR3, DDR2, LPDDR2
I/O StandardsLVCMOS, HSTL, SSTL
Operating Temperature-40°C to +100°C (Industrial), 0°C to +85°C (Commercial)
Package OptionsVarious BGA packages
I/O Voltage3.3V

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