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Xilinx Zynq-7000 Design Guide

Xilinx Zynq-7000
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Zynq-7000 PCB Design Guide www.xilinx.com 62
UG933 (v1.8) November 7, 2014
Chapter 5: Processing System (PS) Power and Signaling
DDR Termination
For better signal integrity, DDR2 and DDR3 clock, address, command and control signals
need to be terminated. For DDR2, ODT and CKE are not terminated and should be pulled
down during memory initialization with a 4.7 k resistor to GND. For DDR3, the DRST_B
signal is not terminated and should be pulled down during memory initialization with a
4.7 k resistor to GND.
LPDDR2 does not require termination.
Table 5-7 shows the DDR termination requirements.
Note:
DDR3 memory also supports terminated DQS signals through the TDQS_P and TDQS_N pins.
This feature is not supported on Zynq-7000
AP SoC devices and those pins should be left floating.
DDR Trace Length
All DDR memory devices should be placed as closely to the Zynq-7000 AP SoC device as
possible. Tab l e 5-8 shows the maximum recommended trace lengths for DDR signals.
V
TT
V
DDQ
/2 V
DDQ
/2 V
DDQ
/2 V
DDQ
/2
Use a DDR termination regulator or a
resistor voltage divider to generate V
TT
and
V
REF
PS_DDR_V
REF0
PD_DDR_V
REF1
V
REF
V
DDQ
/2 V
DDQ
/2 V
DDQ
/2 V
DDQ
/2
Table 5-6: DDR Voltage (Contd)
Voltage LPDDR2 DDR2 DDR3 DDR3L Comments
Table 5-7: DDR Termination
Termination LPDDR2 DDR2 DDR3/3L Comments
Rterm N/A 50 40
Rclk N/A 100 80
Rdown 4.7 K 4.7 K 4.7 K
There is no DDR_DRST_B in LPDDR2/DDR2 device
side
Table 5-8: DDR Max Trace Length
Signal Group LPDDR2 DDR2 DDR3/3L Comments
Data Group 1.5”
2” 2” Without guard-band
5” 5” With guard-band
(1)
Address, Command, Control 1.5”
3” 3” Without guard-band
5” 5” With guard-band
(1)
Notes:
1. A guard-band is a ring of copper driven by a low-impedance source to the same voltage as the high impedance node. It is
used to protect against surface leakage currents.
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Xilinx Zynq-7000 Specifications

General IconGeneral
SeriesZynq-7000
Number of CoresDual-core
Processor SpeedUp to 1 GHz
Device TypeSoC
Logic CellsUp to 350K
DSP SlicesUp to 900
External Memory InterfacesDDR3, DDR2, LPDDR2
I/O StandardsLVCMOS, HSTL, SSTL
Operating Temperature-40°C to +100°C (Industrial), 0°C to +85°C (Commercial)
Package OptionsVarious BGA packages
I/O Voltage3.3V

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