Thermal air restrictions
ASHRAE A3/A4 configuration restrictions
● NVMe SSD and E3.s are not supported
● A2 GPU is not supported.
● 128 GB and 256 GB DIMM is not supported
● CPU TDP restrictions:
○ Air cooled 2.5-inch chassis:
■ Maximum supported CPU TDP is 150 W for one processor configuration
■ Two processor configuration is not supported
○ Air cooled with no backplane chassis
■ Maximum supported CPU TDP is 250 W for one processor configuration
■ Maximum supported CPU TDP is 205 W for two processor configuration
DIMM/HDD/M.2 Blanks Restriction
●
Table 24. DIMM blank requirements
Requirements 1 socket configuration 2 socket configuration
CPU 1 slot CPU 2 slot CPU 1 slot CPU 2 slot
DIMM blank
requirement
Yes No Yes Yes
● All sled slots must be fully populated or blanked.
● All HDD slots must be fully populated or blanked
● BOSS card slot must be populated or blanked
● All PSU slots must be fully populated or blanked
● All E3.s slots must be fully populated or blanked
Mixed Sled Restriction
Mix of 1P sled and 2P sled on the same chassis is restricted. Only homogeneous 1P sleds or homogeneous 2P sleds can be
supported.
Thermal restriction matrix
Temperature restriction for 2.5-inch/2.5-inch PN chassis
Table 25. 2.5-inch chassis, air cooled, 2P (2 processors)
Processor TDP Core count Model CPU1 heat sink CPU2 heat
sink
All storage
configuration
8470Q 350 W 52 XCC N/A N/A N/A
8480+ 350 W 56 XCC N/A N/A N/A
8470 350 W 52 XCC N/A N/A N/A
8468 350 W 48 XCC N/A N/A N/A
8458P 350 W 44 XCC N/A N/A N/A
8468V 330 W 48 XCC N/A N/A N/A
8468H 330 W 48 XCC N/A N/A N/A
8460H 330 W 40 XCC N/A N/A N/A
94 Technical specifications