Dell PowerEdge C6600 - Page 98

Table 30. No backplane chassis and E3.s chassis, air cooled, 1P (continued)
Processor TDP Core count Model CPU1 heat sink CPU2 heat
sink
All storage
configuration
8468 350 W 48 XCC T0FVH
(Extended)
N/A 30
8458P 350 W 44 XCC V3P2V
(General)
N/A 25
8468V 330 W 48 XCC V3P2V
(General)
N/A 25
8468H 330 W 48 XCC V3P2V
(General)
N/A 25
8460H 330 W 40 XCC V3P2V
(General)
N/A 35
8471N 300 W 52 XCC V3P2V
(General)
N/A 35
8470N 300 W 52 XCC V3P2V
(General)
N/A 35
8461V 300 W 48 XCC V3P2V
(General)
N/A 35
8460Y+ 300 W 40 XCC V3P2V
(General)
N/A 35
8452Y 300 W 36 XCC V3P2V
(General)
N/A 35
6454S 270 W 32 XCC V3P2V
(General)
N/A 35
8454H 270 W 32 XCC V3P2V
(General)
N/A 35
6430 270 W 32 XCC V3P2V
(General)
N/A 35
8444H 270 W 16 XCC V3P2V
(General)
N/A 35
6414U 250 W 32 XCC V3P2V
(General)
N/A 35
8450H 250 W 28 XCC V3P2V
(General)
N/A 35
Temperature restrictions for liquid cooled chassis
Table 31. All chassis, liquid cooled (no A2 GPU card)
Processor TDP Core count Model CPU1 heat sink CPU2 heat
sink
All storage
configuration
8470Q 350 W 52 XCC Cold plate Cold plate 35
8480+ 350 W 56 XCC Cold plate Cold plate 35
8470 350 W 52 XCC Cold plate Cold plate 35
8468 350 W 48 XCC Cold plate Cold plate 35
8458P 350 W 44 XCC Cold plate Cold plate 35
8468V 330 W 48 XCC Cold plate Cold plate 35
98 Technical specifications