5. Use the thermal-grease syringe to place 9 uniformly spaced dots of 0.02 mL
each on the top of the microprocessor. The outermost dots must be within
approximately 5 mm of the edge of the microprocessor; this is to ensure
uniform distribution of the grease.
Note: If the grease is properly applied, approximately half of the grease will
remain in the syringe.
6. Install the heat sink onto the microprocessor as described in “Replacing a
microprocessor and heat sink” on page 243.
Removing the system board
Use this information to remove the system board.
About this task
Note:
1. Before you replace the system board, make sure that you backup any features
on demand (FoD) keys that were enabled. Remember to re-enable the features
on demand (FoD) keys after installing the new system board. For more
information on Features on Demand (FoD), including instructions for
automating the activation and installation of the activation key by using IBM
ToolsCenter or IBM Systems Director, see the IBM Features on Demand User's
Guide at /http://www.ibm.com/systems/x/fod/ under the Help section.
2. When you replace the system board, you must either update the server with
the latest firmware or restore the pre-existing firmware from a diskette or CD
image. Make sure that you have the latest firmware or a copy of the
pre-existing firmware before you proceed.
Before you remove the system board from the server, take the following steps to
save data, firmware, and configuration data:
v Record all system configuration information, such as IMM IP addresses, vital
product data, and the machine type, model number, serial number, Universally
Unique Identifier, and asset tag of the server.
Microprocessor
0.02 mL of thermal
grease
Figure 177. Thermal grease distribution
Figure 178. Syringe
Chapter 6. Removing and replacing components 251
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