Thermal/Mechanical Specifications and Design Guide 7
7-25 Package Power SKU Data....................................................................................... 73
7-26 Package Temperature Read Data ............................................................................ 74
7-27 Temperature Target Read ...................................................................................... 74
7-28 Thermal Status Word ............................................................................................ 75
7-29 Thermal Averaging Constant Write / Read................................................................ 75
7-30 Current Config Limit Read Data .............................................................................. 76
7-31 Accumulated Energy Read Data .............................................................................. 76
7-32 Power Limit Data for V
CC
Power Plane...................................................................... 77
7-33 PKG_TURBO_POWER_LIMIT Data............................................................................ 77
7-34 Socket Power Limit Performance Data ..................................................................... 78
7-35 Socket Power-Performance Scalability Data .............................................................. 78
7-36 Socket Performance Indication Data ........................................................................ 78
7-37 Processor ID Construction Example ......................................................................... 80
7-38 RdIAMSR() .......................................................................................................... 80
7-39 PCI Configuration Address...................................................................................... 82
7-40 RdPCIConfig() ...................................................................................................... 83
7-41 PCI Configuration Address for Local Accesses ........................................................... 84
7-42 RdPCIConfigLocal() ............................................................................................... 85
7-43 WrPCIConfigLocal() ............................................................................................... 87
7-44 Intel
®
Core™ i7-3960X, i7-3970X Processor Extreme Edition, Intel
®
Core™ i7-3930K
Processor, and Intel
®
Core™ i7-3820 Processor PECI Power-up Timeline() ................... 89
7-45 Temperature Sensor Data Format ........................................................................... 95
7-46 Temperature Filtering............................................................................................ 95
8-1 Radial Fin Heatsink Assembly ................................................................................. 97
8-2 Tall Heat Pipe Heatsink Assembly............................................................................ 98
8-3 ATX KOZ 3-D Model Primary (Top) Side ................................................................... 99
8-4 T-HPHS Psi-ca versus RPM ................................................................................... 101
8-5 T-HPHS Sound Power (BA) versus RPM .................................................................. 101
8-6 Processor Thermal Characterization Parameter Relationships .................................... 103
A-1 Board Keepin / Keepout Zones (Sheet 1 of 2) ......................................................... 110
A-2 Board Keepin / Keepout Zones (Sheet 2 of 2) ......................................................... 111
B-1 Socket Mechanical Drawing (Sheet 1 of 4).............................................................. 114
B-2 Socket Mechanical Drawing (Sheet 2 of 4).............................................................. 115
B-3 Socket Mechanical Drawing (Sheet 3 of 4).............................................................. 116
B-4 Socket Mechanical Drawing (Sheet 4 of 4).............................................................. 117
D-1 Processor Package Drawing (Sheet 1 of 2) ............................................................. 122
D-2 Processor Package Drawing (Sheet 2of 2) .............................................................. 123
Tables
1-1 Reference Documents ........................................................................................... 12
1-2 Terms and Descriptions ......................................................................................... 12
2-1 Processor Loading Specifications ............................................................................. 17
2-2 Package Handling Guidelines .................................................................................. 17
2-3 Processor Materials ............................................................................................... 18
3-1 LGA2011-0 Socket Attributes ................................................................................. 19
4-1 Square ILM Assembly Component Thickness and Material........................................... 29
5-1 Socket and Retention Component Mass.................................................................... 39
5-2 2011-land Package and LGA2011-0 Socket Stackup Height ........................................ 39
5-3 Socket and ILM Mechanical Specifications ................................................................ 40
5-4 Electrical Requirements for LGA2011-0 Socket.......................................................... 41
6-1 Processor Thermal Specifications ............................................................................ 44
6-2 130W TTV Thermal Profile...................................................................................... 45
6-3 Thermal Solution Performance above TCONTROL for the Intel
®
Core™ i7-3960X, i7-3970X
Processor Extreme Edition, Intel
®
Core™ i7-3930K Processor, and Intel
®
Core™ i7-3820
Processor ............................................................................................................ 46
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