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Intel BX80619I73820

Intel BX80619I73820
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8 Thermal/Mechanical Specifications and Design Guide
7-1 Summary of Processor-specific PECI Commands........................................................53
7-2 Minor Revision Number Meaning..............................................................................57
7-3 GetTemp() Response Definition...............................................................................59
7-4 RdPkgConfig() Response Definition ..........................................................................60
7-5 WrPkgConfig() Response Definition..........................................................................62
7-6 RdPkgConfig() & WrPkgConfig() DRAM Thermal Services Summary..............................63
7-7 Channel & DIMM Index decoding .............................................................................64
7-8 RdPkgConfig() & WrPkgConfig() Processor Thermal and Power Optimization
Services Summary ................................................................................................68
7-9 Platform ID Encoding .............................................................................................71
7-10 Power Control Register Unit Calculations ..................................................................73
7-11 RdIAMSR() Response Definition...............................................................................81
7-12 RdIAMSR() Services Summary ................................................................................81
7-13 RdPCIConfig() Response Definition ..........................................................................83
7-14 RdPCIConfigLocal() Response Definition ...................................................................85
7-15 WrPCIConfigLocal() Response Definition ...................................................................87
7-16 WrPCIConfigLocal() Memory Controller Device/Function Support..................................88
7-17 PECI Client Response During Power-Up ....................................................................88
7-18 SOCKET ID Strapping ............................................................................................89
7-19 Power Impact of PECI Commands versus C-states .....................................................90
7-20 Domain ID Definition .............................................................................................92
7-21 Multi-Domain Command Code Reference ..................................................................93
7-22 Completion Code Pass/Fail Mask..............................................................................93
7-23 Device Specific Completion Code (CC) Definition........................................................94
7-24 Originator Response Guidelines ...............................................................................94
7-25 Error Codes and Descriptions ..................................................................................96
8-1 Processor Reference Thermal Boundary Conditions ....................................................97
8-2 Reference Heat Sink Clearance above the Motherboard ..............................................99
8-3 Intel® Reference Thermal Solution TIM.................................................................. 100
8-4 Fan Speed Control, TCONTROL and DTS Relationship ............................................... 103
9-1 Use Conditions Environment (System Level) ...........................................................105
9-2 Use Conditions Environment (System Level) ...........................................................106
A-1 Mechanical Drawing List .......................................................................................109
B-1 Socket Drawing List............................................................................................. 113
C-1 Suppliers for the Intel
®
Reference Thermal Solutions ...............................................119
C-2 Suppliers for the LGA2011-0 Socket and ILM ..........................................................120
C-3 Suppliers for the LGA-2011-0 Socket and ILM (Continued)........................................120
D-1 Mechanical Drawing List .......................................................................................121

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