RL78/G13 CHAPTER 29 ELECTRICAL SPECIFICATIONS
R01UH0146EJ0100 Rev.1.00 1004
Sep 22, 2011
Caution The pins mounted depend on the product. Refer to 2.1.1 20-pin products to 2.1.14 128-pin products,
and 2.1.15 Pins for each product (pins other than port pins).
Notes 1. Total current flowing into V
DD, EVDD0 and EVDD1, including the input leakage current flowing when the level of
the input pin is fixed to VDD, EVDD0 or VSS, EVSS0. The values below the MAX. column include the peripheral
operation current. However, not including the current flowing into the A/D converter, LVD circuit, I/O port, and
on-chip pull-up/pull-down resistors.
2. During HALT instruction execution by flash memory.
3. When high-speed on-chip oscillator and subsystem clock are stopped.
4. When high-speed system clock and subsystem clock are stopped.
5. When operating real-time clock (RTC) and setting ultra-low current consumption (AMPHS1 = 1). When high-
speed on-chip oscillator and high-speed system clock are stopped. When watchdog timer is stopped. The
values below the MAX. column include the leakage current.
6. When high-speed on-chip oscillator, high-speed system clock, and subsystem clock are stopped. When
watchdog timer is stopped. The values below the MAX. column include the leakage current.
7. Relationship between operation voltage width, operation frequency of CPU and operation mode is as below.
High speed operation: V
DD = 2.4 V to 5.5 V@1 MHz to 32 MHz
Low speed operation: V
DD = 1.8 V to 5.5 V@1 MHz to 8 MHz
Low voltage operation: V
DD = 1.6 V to 5.5 V@1 MHz to 4 MHz
Remarks 1. f
MX: High-speed system clock frequency (X1 clock oscillation frequency or external main system clock
frequency)
2. f
IH: High-speed on-chip oscillator clock frequency
3. f
SUB: Subsystem clock frequency (XT1 clock oscillation frequency)
4. Except subsystem clock operation and STOP mode, temperature condition of the TYP. value is T
A = 25°C
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