Table B-29. MSP-TS430RGC64USB Bill of Materials
Pos. Ref Des No. Per Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805
2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
3
C5, C11, C13,
C14
4 100nF, SMD0805 311-1245-2-ND
3.1 C10, C12 0 10uF, SMD0805 DNP: C10, C12
4 C8 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND
7 J1, J2, J3, J4 4 16-pin header, TH
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
SAM1029-16-ND : Header
SAM1213-16-ND
: Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
9
JP5, JP6, JP7,
JP8, JP9,
JP10
6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
12 10 Jumper 15-38-1024-ND
Place on: JP1, JP2, JP3, JP4,
JP5, JP6, JP7, JP8, JP9, JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
14 Q1 0 Crystal
Q1: Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
DNP: Q1
Keep vias free of solder
15 Q2 1 Crystal Q2: 4MHz Buerklin: 78D134
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
17
R1, R2, R4,
R6, R8, R9,
R12
2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12
18 R10 1 100 Ω, SMD0805 Buerklin: 07E500
18 R11 1 1M Ω, SMD0805
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket: QFN11T064-006 Manuf.: Yamaichi
20 PCB 1 79 x 77 mm 2 layers
21
Rubber stand
off
4 Buerklin: 20H1724 Apply to corners at bottom side
22 MSP430 2 MSP430F5509 RGC
DNP: enclosed with kit. Is
supplied by TI
23
Insulating disk
to Q2
1 Insulating disk to Q2
http://www.ettinger.de/
Art_Detail.cfm?
ART_ARTNUM=70.08.121
27 C33 1 220n SMD0603 Buerklin: 53D2074
28 C35 1 10p SMD0603 Buerklin: 56D102
29 C36 1 10p SMD0603 Buerklin: 56D102
30 C38 1 220n SMD0603 Buerklin: 53D2074
31 C39 1 4u7 SMD0603 Buerklin: 53D2086
32 C40 1 0.1u SMD0603 Buerklin: 53D2068
33 D2, D3, D4 3 LL103A Buerklin: 24S3406
Hardware www.ti.com
120 MSP430™ Hardware Tools SLAU278AG – MAY 2009 – REVISED DECEMBER 2020
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