Table B-10. MSP-TS430DW28 Bill of Materials
Position Ref Des
No. per
Board
Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805
DNP: C1, C2, Cover holes while
soldering
2 C5 1 100nF, SMD0805
3 C7 1 10uF, 10V Tantal Elko B
4 C8 1 10nF SMD0805
5 D1 1 LED3 T1 3mm yellow RS: 228-4991
6 Q1 0 QUARZ, Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
DNP: Cover holes while soldering
7 J1, J2 2 14-pin header, TH male
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder.
: Header
: Receptacle
7.1 2 14-pin header, TH female
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder.
: Header
: Receptacle
8 J3 1 3-Pin Connector, male
9 J4, J5 2 2-Pin Connector, male With jumper
10 BOOTST 0 ML10, 10-Pin Conn., m RS: 482-115 DNP, Cover holes while soldering
11 JTAG 1 ML14, 14-Pin Conn., m RS: 482-121
12
R1, R2, R6,
R7, R8,R9,
R10, R11
4 0R, SMD0805 DNP: R1, R2, R9, R10
13 R3 1 560R, SMD0805
14 R5 1 47K, SMD0805
15 U1 1 SOP28DW socket Yamaichi: IC189-0282-042
16 U2 0 TSSOP DNP
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SLAU278AG – MAY 2009 – REVISED DECEMBER 2020
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