Table B-37. MSP-TS430PZ100B Bill of Materials
Position Ref Des
No. per
Board
Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
2
C4, C5, C6 ,
C7, C8, C9
6 100nF, SMD0805 311-1245-2-ND
3 C10, C26 2 470 nF, SMD0805 478-1403-2-ND
4 C11, C12 1 10 uF / 6.3 V SMD0805 C12 DNP
5
C13, C14,
C16, C18,
C19, C29
6 4.7 uF SMD0805
6 D1 1 green LED, SMD0805 P516TR-ND
7
J1, J2, J3,
J4
0 25-pin header, TH
SAM1029-25-ND (Header)
SAM1213-25-ND
(Receptacle)
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder:
8 J5 1 3-pin header, male, TH
9
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7 3-pin header, male, TH SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on
pins 1-2 on JP3,
10
JP1, JP2,
JP4
3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
11
JP11, JP12,
JP13
3 4-pin header, male, TH place jumper on header 1-2
12 13 Jumper 15-38-1024-ND See Pos. 9 and Pos. 10 and Pos. 11
15 JTAG 1
14-pin connector, male,
TH
HRP14H-ND
16 BOOTST 0
10-pin connector, male,
TH
"DNP Keep vias free of solder"
17 Q1 0 Crystal DNP: Q1 Keep vias free of solder
21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
22
R1, R2, R4,
R6, R8,
R10, R11
2 0 Ohm, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R10, R11
23 R5 1 47k Ω, SMD0805 541-47000ATR-ND
24 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi
25 PCB 1 90 x 82 mm 2 layers
26
Adhesive
plastic feet
4
Approximately 6mm width,
2mm height
for example, 3M Bumpons
Part No. SJ-5302
Apply to corners at bottom side
27 MSP430 2 MSP430F6733IPZ DNP: enclosed with kit, supplied by TI
Hardware www.ti.com
148 MSP430™ Hardware Tools SLAU278AG – MAY 2009 – REVISED DECEMBER 2020
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