Table B-16. MSP-TS430RSB40 Bill of Materials
Pos. Ref Des No. Per Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
2
C3, C7, C10,
C12
3 10uF, 10V, SMD 0805 445-1371-1-ND DNP C12
3
C4, C6, C8,
C11
3 100nF, SMD0805 311-1245-2-ND DNP C11
4 C5 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805
6 D1 1 green LED, SMD0805 P516TR-ND
7 J1, J2, J3, J4 4 10-pin header, TH
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
: Header
: Receptacle
7.1 4 10-pin header, TH
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
: Header
: Receptacle
8
JP1, JP4,JP5,
JP6, JP7, JP8,
JP9, J5, JP10
9 3-pin header, male, TH SAM1035-03-ND
Jumper: 1-2 on JP1, JP10; 2-3
on JP4-JP9
9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
11 BOOTST 0 10-pin connector, male, TH DNP. Keep vias free of solder
12 U1 1
QFN-40B-0.4_
ENPLAS_SOCKET
Enplas
13 Q1 0 Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) = 12.5pF
DNP: Q1. Keep vias free of
solder
15 10 Jumper 15-38-1024-ND
Place on: JP1, JP2, JP3, JP4,
JP5, JP6, JP7, JP8, JP9, JP10
16 R1,R7 2 330R SMD0805
17
R2, R3, R5,
R6, R8, R9,
R10
3 0R SMD0805 DNP R2, R3, R5, R6
18 R4 1 47k SMD0805
19 MSP430 2 MSP430F5132
DNP: enclosed with kit. Is
supplied by TI
20
Rubber stand
off
4
select appropriate; for example,
Buerklin: 20H1724
apply to corners at bottom side
www.ti.com
Hardware
SLAU278AG – MAY 2009 – REVISED DECEMBER 2020
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MSP430™ Hardware Tools 77
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