Toshiba e-STUDIO Series - Table of Contents

© 2021 Toshiba Tec Corporation All rights reserved MFP ENTRY GUIDE
CONTENTS
1
CONTENTS
1. Overview....................................................................................................................... 1-1
1.1 Preface.............................................................................................................................. 1-1
1.2 About MFPs ...................................................................................................................... 1-1
1.3 About Options ................................................................................................................... 1-2
1.4 Destinations ...................................................................................................................... 1-3
1.5 Terms and Abbreviations .................................................................................................. 1-4
1.6 Operator’s Manual............................................................................................................ 1-7
2. MFP BASIC TECHNOLOGIES ..................................................................................... 2-1
2.1 Overview ........................................................................................................................... 2-1
2.1.1 Mechanism ........................................................................................................ 2-1
2.2 Scanning Section .............................................................................................................. 2-2
2.2.1 Scanner ............................................................................................................. 2-2
2.3 Image Forming Section..................................................................................................... 2-4
2.3.1 Basic process .................................................................................................... 2-4
2.3.2 Color process..................................................................................................... 2-5
2.3.3 Image processing .............................................................................................. 2-7
2.3.4 Charging ............................................................................................................ 2-9
2.3.5 Writing.............................................................................................................. 2-10
2.3.6 Development.................................................................................................... 2-11
2.3.7 Transferring ..................................................................................................... 2-12
2.3.8 Transfer belt cleaning ...................................................................................... 2-14
2.3.9 Photoconductive drum cleaning....................................................................... 2-14
2.3.10 Fusing .............................................................................................................. 2-15
2.3.11 Image quality control........................................................................................ 2-15
2.4 Paper Feeding and Transporting Section ....................................................................... 2-16
2.4.1 Overview.......................................................................................................... 2-16
2.4.2 Separation mechanism .................................................................................... 2-17
2.4.3 Alignment mechanism ..................................................................................... 2-18
2.5 Paper Exit Section and Reverse Section ........................................................................ 2-19
2.5.1 Overview.......................................................................................................... 2-19
2.5.2 Paper exiting mechanism ................................................................................ 2-20
2.5.3 Reversing mechanism ..................................................................................... 2-20
2.6 Operation Section ........................................................................................................... 2-21
2.6.1 Control panel ................................................................................................... 2-21
2.6.2 Power supply mechanism................................................................................ 2-24
3. MAJOR OPERATIONS FROM INSTALLATION TO RETURN .................................... 3-1
3.1 Unpacking and Installation................................................................................................ 3-1
3.2 Preventive Maintenance.................................................................................................... 3-2
3.2.1 Overview of Preventive Maintenance ................................................................ 3-2
3.2.2 Preventive maintenance parts (PM parts) ......................................................... 3-2
3.2.3 Refreshment ...................................................................................................... 3-2
3.2.4 Conceptual drawing ........................................................................................... 3-2
3.3 Errors and Clearing ........................................................................................................... 3-3
3.3.1 Overview of the error code ................................................................................ 3-3
3.3.2 Clearing of errors ............................................................................................... 3-3
3.3.3 Precautions when replacing the PC boards....................................................... 3-4
3.4 Adjustment ........................................................................................................................ 3-5
3.4.1 Purposes............................................................................................................ 3-5
3.4.2 Implementation timing........................................................................................ 3-5
3.4.3 Type................................................................................................................... 3-5
3.4.4 Precautions when performing adjustment ......................................................... 3-6
3.5 Firmware updating ............................................................................................................3-7
3.5.1 Method............................................................................................................... 3-7
3.5.2 Updating type..................................................................................................... 3-7