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Xilinx Zynq-7000 Design Guide

Xilinx Zynq-7000
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Zynq-7000 PCB Design Guide www.xilinx.com 64
UG933 (v1.8) November 7, 2014
Chapter 5: Processing System (PS) Power and Signaling
Note: For PS_DDR_DQxx, ensure that byte lines are kept together. PS_DDR_ADDR0 should always be
used. If bits must be omitted for chip select or other functionality, omit upper bit (PS_ADDR14)
instead.
In a balanced T-branch configuration, trace lengths TL1, TL2 and Tsub shall be kept as short
as possible; Rterm shall be close to and balanced among the loads.
In a point-to-point configuration, Rterm shall be placed behind and close to the last load.
In the fly-by topology, TL0 should be kept from 0-64 mm, with TL1 14 mm ±0.1 mm, and
TL2 from 6-20 mm.
Table 5-12 shows the recommended routing topologies. Byte and bit swapping is allowed
to facilitate PCB routing, except for LPDDR2, which specifically forbids swapping. When
swapping bits, keep all bits within the same byte group.
X-Ref Target - Figure 5-8
Figure 5-8: DDR Routing Topologies
ZYNQ
DDR
VTT
VTT
Tsub
Tsub
TL2
TL0
TL1
Rterm Rterm
Balanced T-branchPoint-to-point
UG585_c30_07_091913
DDR
DDR
DDR
DDR
DDR DDR DDR DDR
VTT
Rterm
TL0
TL1 TL1 TL1
TL2
Fly-by
Table 5-12: DDR Routing Topology
Signal Group LPDDR2 DDR2 DDR3/3L
Number of DDR
Devices
Data Point-to-point Point-to-point Point-to-point
Clock
Point-to-point Point-to-point Point-to-point 1
T-branch T-branch Fly-by 2
N/A T-branch Fly-by 4
Address,
Command,
Control
Point-to-point Point-to-point Point-to-point 1
T-branch T-branch Fly-by/T-branch 2
N/A T-branch Fly-by/T-branch 4
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Xilinx Zynq-7000 Specifications

General IconGeneral
SeriesZynq-7000
Number of CoresDual-core
Processor SpeedUp to 1 GHz
Device TypeSoC
Logic CellsUp to 350K
DSP SlicesUp to 900
External Memory InterfacesDDR3, DDR2, LPDDR2
I/O StandardsLVCMOS, HSTL, SSTL
Operating Temperature-40°C to +100°C (Industrial), 0°C to +85°C (Commercial)
Package OptionsVarious BGA packages
I/O Voltage3.3V

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