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3. Grounding/Bonding. The inverter provides 1 grounding connection
on the AC side and one bonding location. These configurations are
illustrated below (Figure 3-33).
A. Grounding via the ground busbar (left) [1] This is required for
grounding the equipment by running the EGC with the
ungrounded conductors.
B. Bonding via the external grounding point (right) [2]. The external
bonding connection is provided in case the inverter/mount needs
to be bonded to a metallic structure on which it may be mounted.
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