MECHANICAL SPECIFICATIONS
Form Factor: PCI/104-Express form factor compliant (PCIe, PCI buses)
Card only: 3.6” x 3.8” (90 x 96 mm) L x W (excluding Ethernet connector extensions)
Card with Thermal Plate: 3.86” x 4.11” x 0.63” (98 x 104.5 x 16mm) L x W x H (excluding
Ethernet and bottom-side bus connector extensions)
Weight: card only =. 0.24 lbs (0.11 kg); card with thermal plate = 0.47 lbs (0.21 kg)
Passive thermal management: optional integrated thermal plate for conductive cooling to
optimize/ease system integration
Conformal coating for additional humidity protection (optional)
No moving parts
Assembled to IPC-A-610 Class III Workmanship
Industrial temperature grade components
CONNECTOR SPECIFICATIONS
Refer to "Chapter 5 Connector Descriptions" for connector details.
Ethernet connectors:
Right-Angle Molex (8-port configuration)
Right-Angle Harwin Datamate (20-port configuration)
Recommended mating connectors support hand crimping of CAT5e wiring and include latching
mechanisms for vibration mitigation.
Harwin connector can also support card-to-card cableless interface.
These card (de)population options are available:
No PCI/104-Express or PCI/104 buses
ENVIRONMENTAL SPECIFICATIONS
Designed to meet MIL-STD-810G:
Operating/Storage Temperature: -40° to +85°C / -40° to +185°F (MIL-STD-810G, Methods
501,502) with proper thermal management.
Operating Shock: 40g, 11ms, 3 pos/neg per axis (MIL-STD-810G, Method 516)
Random Vibration: Jet-Helo-Tracked Vehicle Profile, 3 Axes (MIL-STD-810G, Method 514)
Humidity: Up to 95% RH @ 40C, non-condensing (special order: conformal coating).
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